tag:blogger.com,1999:blog-19092890.post4162675870021366778..comments2024-03-19T08:15:45.946+02:00Comments on Image Sensors World: Samsung Announces 3-Layer ISOCELL Fast SensorVladimir Koifmanhttp://www.blogger.com/profile/01800020176563544699noreply@blogger.comBlogger1125tag:blogger.com,1999:blog-19092890.post-28565823161611633842018-03-01T08:10:14.352+02:002018-03-01T08:10:14.352+02:00interesting to see that the connection to the pack...interesting to see that the connection to the package still is done with wirebonds while the chip itself uses a direct bonding between the layers... What are the technical reasons for using wirebonds here?Anonymousnoreply@blogger.com