tag:blogger.com,1999:blog-19092890.post817031249451245052..comments2024-03-19T08:15:45.946+02:00Comments on Image Sensors World: Oppenheimer Talks About OmniBSI-2 Production ProblemsVladimir Koifmanhttp://www.blogger.com/profile/01800020176563544699noreply@blogger.comBlogger3125tag:blogger.com,1999:blog-19092890.post-36355182721622013672011-11-10T00:54:29.092+02:002011-11-10T00:54:29.092+02:00thanks eric. i appreciate your response.
eric kar...thanks eric. i appreciate your response.<br /><br />eric karrAnonymousnoreply@blogger.comtag:blogger.com,1999:blog-19092890.post-11219342049305024232011-11-09T19:33:25.387+02:002011-11-09T19:33:25.387+02:00The latter part does not sound like it is related ...The latter part does not sound like it is related to wafer bonding to me, but it is not easy to tell from just a few sentences. Bringing up a new process is always filled with issues like this. TSMC is very strong on manufacturing issues and probably the problem could not be in better hands. <br /><br />Probably Omnivision wishes they had not be so publicly vocal on the anticipated rollout of their BSI-2 generation. It is not always good to be first and hence the term "bleeding edge".Eric R Fossumhttps://www.blogger.com/profile/09740612324630105312noreply@blogger.comtag:blogger.com,1999:blog-19092890.post-45267309163738550052011-11-09T16:27:06.235+02:002011-11-09T16:27:06.235+02:00please forgive me for not being technologically sa...please forgive me for not being technologically savvy, but is there any way that these issues could have been avoided by licensing ziptronix bonding process? TIA<br /><br />EK<br /><br />ps: thanks for posting this vlad.Anonymousnoreply@blogger.com