Monday, October 20, 2008

TSV Rollercoaster

Philip Garrou from Semiconductor International anticipates a surge of activity in TSV and 3D integration in image sensors. He summarizes TSV activities by all the leading image sensor makers in his nice blog message from a month ago. A newer post paints a bigger picture where image sensor TSV adoption is just a first step of large scale TSV move.


  1. Why is TSV important for CIS? Doesn't BSI get the pads where they need to be with no effort?

  2. BSI needs TSV even more. The pads in BSI are stacked between the two bonded wafers and there is no access to them, if not TSV.


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