tag:blogger.com,1999:blog-19092890.post6346103337699490393..comments2024-03-28T17:41:43.970+02:00Comments on Image Sensors World: IEDM 2018 Image Sensor PapersVladimir Koifmanhttp://www.blogger.com/profile/01800020176563544699noreply@blogger.comBlogger1125tag:blogger.com,1999:blog-19092890.post-50440033457531317072018-11-12T11:11:30.980+02:002018-11-12T11:11:30.980+02:00There's also this one, which unfortunately ove...There's also this one, which unfortunately overlaps with the imager session papers: <br /><br />7.3 Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness, J. Jourdon, et al, STMicroelectronics, *University of Bordeaux, **CEA-LETI<br /><br />abstracts are published meanwhile too: for the above one: "We present the first 3D-stacked CMOS Image Sensor with a bonding pitch of 1.44 µm. The influence of the hybrid bonding pitch shrinkage (8.8 to 1.44 μm) from the process point of view to a functional device via the robustness aspect is studied. Smaller bonding pads do not lead to any specific failure "<br />Guy Meynantshttps://www.blogger.com/profile/08681499907325206298noreply@blogger.com