Yahoo-Finance: Dongbu is advancing CIS wafer processing from the 0.18-micron to the 130nm node. Dongbu's new process enables the manufacture of CIS devices with 1.3 Megapixel resolution and 1.5V supply voltage.
The new process also promises a greatly enhanced resolution, gray scale and relative illumination thanks to proprietary Dongbu processing techniques and technologies that have virtually eliminated "dark current" widely believed to be the most difficult problem to resolve in CIS imaging.
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