Micron Expands in Packaging?

EETimes interviewed Steve Appleton, Micron's CEO. Here is what he told on what links are missing from its image sensor line:

EE Times: Is there a missing piece in Micron's strategy?

Appleton: Yes, there is a missing piece. It's packaging. We do a lot of packaging as you know. We have a big assembly operation. But in an integrated model, we are missing parts of the packaging for the next-generation of applications. In particular, when you think how that translates to the imaging business, you think about wafer-level modules, lenses, and camera module integration. We have a lot of partners for that.

EE Times: So do you acquire a company or bring more expertise in house?

Appleton: We will do both. We will acquire companies that have expertise in the area. At the same time, we will also have to continue partnerships.