Tessera Wafer Level Camera

After many years in development Tessera finally announced a new wafer-level camera technology OptiML WLC (also known as OptiuL WLC).

Using OptiML WLC technology, thousands of lenses are manufactured simultaneously on a wafer, and then bonded at the wafer level to create the optical element of the camera. The result is simplified assembly, up to 30% cost savings for the optical component of the camera module and up to 50% size reductions over conventional camera phone modules. Tessera's recently acquired Eyesquad technology can be easily integrated into the OptiML WLC solution, providing advanced auto-focus and digital optical zoom without the use of moving parts.

Update: EETimes too published the announcemnet. Tessera claims the "Z" dimension for the OptiML WLC's VGA implementation comes in at 2.5 mm. Eyesquad's digital focus technology becomes crucial when wafer-level cameras need 2-megapixel resolution or better.

The first working-prototype module made to custom specs using OptiML WLC will emerge at the end of next quarter. Wafer-level cameras will be incorporated in handsets by the end of 2008.