Tech-On: Tower's roadmap sees CIS pixel production at 1.7µm by 2008, and 1.4µm by 2009.
Tower's advanced photo diode (APD) 0.18µm process delivers CMOS image sensors for fabless firms like Biomorphic Microsystems, e2v, Forza Silicon and Chinese firm SuperPix.
The chips utilize Tower's pixel IP and optically optimized multilayer metallization, which "...achieves dramatically better optical sensitivity by reducing stack height from silicon to microlens. We recently developed a state-of-the-art 2.2µm pixel sensor for handsets and stills cameras, delivering high-density good-quality pictures at very competitive cost," said Rafi Nave, Tower's CTO.
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