Digitimes: Xintec, an affiliate of TSMC, has completed equipment installation at its first 12-inch wafer-level chip size packaging (WL-CSP) fab at the Hsinchu Science Park (Fab 3), and volume production is scheduled for the first quarter of 2008.
To meet strong demand for CMOS image sensors from the handset and digital camera segments, Xintec already completed the capacity expansion of its 8-inch WL-CSP Fab 2 in the second quarter of 2007. The 8-inch fab now has a monthly capacity of 36,000 wafers, and it will continue to expand in the future, the company said.
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