Yahoo: Dongbu showcases its first VGA, 1.3MP and 2MP sensors and camera phone modules at the International IC China (IIC China) trade show, which opens in Shenzhen on March 3, 2008. They are the first fruits of Dongbu's internal development efforts. No pixel size or other technical data is stated, so I assume the sensors are pretty much generic.
The PR names China as Dongbu's high-priority target market and emphasizes Dongbu HiTek executives meeting with the executives from China’s mobile handset developers including Mobile Innovation Chip Technology and Ginwave Technologies.
In July 2007 Dongbu entered into a strategic partnership with China based HNT, a camera module manufacturer. The HNT partnership is expected to expand Dongbu HiTek’s monthly capacity to produce camera modules by approximately 1M units, while also ensuring a stable supply to Chinese OEMs.
“Our focus on developing competitive, high quality CIS chips and camera modules will continue to intensify over the course of 2008,” stated Hae-Soo Jeong, Dongbu HiTek Senior EVP.
No comments:
Post a Comment
All comments are moderated to avoid spam and personal attacks.