IMAPS-Benelux chapter has held an Imaging and Display Packaging workshop in Leuven, Belgium on April 10. Most presentations were devoted to 3D packages with through-silicon-vias (TSV) (Philips Research Labs, IMEC, Nikhef). Another interesting presentation came from Melexis on low-cost plastic packages for automotive applications.
Thanks to Albert Theuwissen for sending me the workshop program.
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