ST On Image Sensor Challenges

Jean-Luc Jaffard from ST imaging Division delivered a good image sensor presentation on Design Automation and Test in Europe Conference (DATE'08). Some interesting parts from the presentation:

1. Due to ever increasing number of special process tweaks in modern sensor manufacturing, "CMOS Process with Imager Options" migrates towards "Imager Process, CMOS Capable".
   
   
2. ST is going to use 12" Cu wafers for 1.4um pixel production.
   
   
3. 3D sensor-analog front end integration gives only 30% of full well increase for 1.4um pixels, despite the added process complexity and cost.
   
   
4. Same BW BSI images and graphs appear. I wonder why ST does not show its color results. It's hard to support claims on BSI superiority without bayer-patterned sensor QE graphs.