Semiconductor International reviews TSV papers from 2009 ECTC (Electronic Components and Technology Conference).
In one of the papers CEA Leti , Brewer Science and EVG present the use of a temporary thinning carrier in the ST Micro TSV image sensor product. The product relies on 70um-sized TSVs in 70um-thinned wafer, so vias aspect ratio is 1:1.
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