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Tuesday, October 06, 2009

EV Group Installs Fusion Wafer Bonders at Two Image Sensor Manufacturing Facilities in Asia

Yahoo: EV Group (EVG) announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI FB automated production fusion bonding systems will be employed for the production of BSI CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger form factor high-end image sensors.
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4 comments:

  1. AnonymousOctober 6, 2009 at 10:16 PM

    Who would be the lucky user(s?)

    ReplyDelete
  2. AnonymousOctober 12, 2009 at 8:35 PM

    Probably Xintec and China WLCSP

    ReplyDelete
  3. AnonymousOctober 12, 2009 at 8:36 PM

    There are two other candidates:
    Visera (TSMC) and UMC

    ReplyDelete
  4. AnonymousOctober 13, 2009 at 8:06 PM

    UMC for Imager in 300mm ?
    Do you see Chinese going capex these days ?

    ReplyDelete

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