OptoPAC Technology Presentation

OptoPAC kindly sent me an interesting presentation describing NeoPAC packaging. The 62 slides in the presentation are too many to publish here, I tried to select the most interesting ones (click on them for a bigger picture):

NeoPAC advantages are said to be:

• AdvantagesCSP –Low mass, Thin, and Small
• Excellent co-planarity between Image Sensor and Glass( << 5μm )
• Minimal Shift and Rotation in Image sensor( << 5μm )
• Peripheral area allows for direct lens holder attachment (suitable for LOG module)
• Optimal co-planarity between sensor and lens through LOG structure
• NeoPAC RED does not need separate IR filter glass, improves transmittance and reduces module height
• Cost effective no focus module using NeoPAC RED and LOG structure
• Minimal tilt between sensor and lens leads to excellent resolution in AF module
• Excellent electrical and thermal performance through flip chip solder joint technologySimpler camera module process and better reliability / quality vs. Chip-On-Board (COB)
• Proven image sensor package for the mobile market
  • Leading solution with 20M/month shipping to China

Still some improvement is needed:

• Contamination is possible through air vent
  • No issue with good assembly process control
  • Issue at a limited number of assemblers but needed to be addressed
• Removal and re-use of package requires placement of new solder balls
  • OptoPAC provides a re-balling service in its Shenzhen office
• Board level reliability for TC and/or bending without using underfill
  • Required for reflowable mobile, PC cam, and automotive camera module

With this in mind NeoPAC® Keyi package was developed (Keyi in Chinese means “can do”):

NeoPAC Keyi Advantages:

•  With NeoPAC Keyi there is no possibility of contamination during:
  • IPA glass cleaning,
  • Solder reflow,
  • Side fill and holder attach.
• Board level reliability with polymer core balls significantly improved
  • Drop, Bending and Thermal Cycle testing passed without using underfill
  –Competitive CSPs and TSV based products required underfill to pass same tests

NeoPAC Red offers integrated IR blocking coating:

NeoPAC Lens-On-Glass (LOG) module:

Precisely assembled NeoPAC No-Focus Module (N2M):

NeoPAC AF module with 1/4-inch 3MP 1.75um sensor (S5K4CDGX):

Thanks to Peter Elenius for sending me the presentation!