Friday, May 06, 2011
Biggest Imager Ever Made on 8" Wafer
PC World: University of Lincoln (UK) announced it has created the 12.8cm by 12.8cm square imager claimed to be the biggest ever made on 200mm wafer. Nigel Allinson, Distinguished Professor of Image Engineering at Lincoln created "DynAMITe" sensor, said: "DynAMITe was designed for medical imaging, in particular mammography and radiotherapy, so the individual pixels are much larger than those found in consumer digital cameras or mobile phones. As it will withstand exposure to very high levels of x-ray and other radiation, it will operate for many years in the adverse environment of cancer diagnosis and treatment instruments; and represents a major advance over the existing technology of amorphous Silicon panels."
The claim is not correct. I have personally seen a bigger one more than two years ago
ReplyDeleteLincoln's imager has 181mm diagonal - quite close to the 200mm wafer size. Are you sure that your bigger sensor used 200mm wafers?
ReplyDeleteyes, i am.
ReplyDeleteThe sensor was 14cm x 12.1cm, so in area, slightly bigger than this one.
"the biggest ever made on 200mm wafer ..."
ReplyDeleteNot the biggest one in the world !
any word on yields?
ReplyDeleteTeledyne DALSA presented a larger, 13.0cm x 13.0cm CMOS imager with 100um pixels made on 8" wafers at ISE in London in March. This imager is also radiation-hard and three-side buttable. An integrated X-ray detector using this imager is presented on their website
ReplyDeletehttp://www.teledynedalsa.com/ls/products/cameras/family.aspx?fam=Xineos
Hamamatsu has made one 12.5 x 12.5 cm for years. See: http://sales.hamamatsu.com/assets/pdf/parts_C/c10900d_kacc1167e05.pdf
ReplyDeleteWhen they originlly introduced this device, they also displayed a single imager on a 12" wafer (at Photonics West, some years ago). That one was quietly removed from the market, I believe after the yields were confirmed to be 0%.
Anyone know which foundry was used for the Lincoln product? I thought remembering that they work with Tower, but I am not 100% sure.
ReplyDeleteCanon has shown a 202x205mm CMOS image sensor on a 300mm wafer at the Canon Expo Tokyo 2010 on November 10, 2010.
ReplyDelete@ Jack Amano
ReplyDeleteThe claim of he University of Lincoln is this is the largest imager on an 8" wafer - obviously one can make bigger ones on a 12" wafer...
Just to clear up the doubts. This is the largest radiation-hard sensor to date. Dalsa's one is not. Yield is above 65%. I can't comment on foundry used. Canon has successfully made on 300 mm wafers but not for commercial use, I understand.
ReplyDeleteEvery Dalsa product released in 2009 and later is radiation hard. The sensors before 2009 were not. That means that the Xineos was at that time, and still is today the largest, radiation hard sensor on a 200mm process.
ReplyDeleteHi, we are interesting to develop FPD.How can we buy this wafer?
DeleteHi Anonymous,Do know how can we buy this kind wafer?We are interesting and looking for these.
ReplyDeleteCan you mail me some information?handy33@126.com