Yole Predicts 75um Thin CIS Wafers in 2014

Yole Développement's report "Thin Wafer Market & Applications" predicts that thinned wafers will reach 50% of all wafer shipments in 2016, up from 27% today. "Motivations for thin wafers are: high interconnect density (such as aggressive TSV pitch & diameters), better power dissipation and higher electrical performance and reduced package size."

Here is how image sensor wafer thickness looks in comparison with others: