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Thursday, October 06, 2011

Yole Predicts 75um Thin CIS Wafers in 2014

Yole Développement's report "Thin Wafer Market & Applications" predicts that thinned wafers will reach 50% of all wafer shipments in 2016, up from 27% today. "Motivations for thin wafers are: high interconnect density (such as aggressive TSV pitch & diameters), better power dissipation and higher electrical performance and reduced package size."

Here is how image sensor wafer thickness looks in comparison with others:

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