Chipworks concludes its full frame sensor reviews by a discussion of the new Leica "M" rangefinder sensor designed by CMOSIS in cooperation with ST and manufactured by ST. The sensor is based on ST's IMG175 300 mm Cu process, originally developed for 1.75um mobile CIS. The process has been adapted to 6um pixels and use 0.11um design rules for the front end of line (FEOL) processing and 90nm design rules for the BEOL. This is the most advanced process node among the full frame sensors vendors.
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