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Wednesday, February 13, 2013

Chipworks Publishes Sony Stacked Sensor Reverse Engineering Report

Chipworks got a hold of Sony stacked sensor, the ISX014. The 8MP sensor features 1.12um pixels and integrated a high speed ISP.

Cross Section Showing the TSVs

Chipworks says: "A thin back-illuminated CIS die (top) mounted to the companion image processing engine die and vertically connected using a through silicon via (TSV) array located adjacent to the bond pads. A closer look at the TSV array in cross section shows a series of 6.0 µm pitch vias connecting the CIS die and the image processing engine."

Thanks to RF for updating me!
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2 comments:

  1. AnonymousFebruary 14, 2013 at 10:36 AM

    TSVs for a face to face connection? Why???

    ReplyDelete
  2. AnonymousFebruary 15, 2013 at 11:42 AM

    I think that this is wafer-to-wafer bonding. So it's necessary to create final bonding pads on the top of the assembly.

    ReplyDelete

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