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Saturday, August 31, 2013

Sony Stacked Sensor Cross-Section

Phil Garrou has published a cross-section of 13MP Sony IMX135 stacked sensor, presented by Dick James of Chipworks at Confab conference in June 2013. The wafers are stacked front-to-front. The pixel layer uses 90nm process, while the bottom image processor is made in 65nm process:

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