No it's not. Stacked sensors are no less bendable than normal BSI sensors. With a stacked sensor you are replacing the blank carrier wafer with an active wafer. The final thickness of the stack can be very thin.
3D sensors only means two layers of silicon for the foreseeable future.
If Sony's curved sensor works 3D IC is dead...
ReplyDeleteNo it's not. Stacked sensors are no less bendable than normal BSI sensors. With a stacked sensor you are replacing the blank carrier wafer with an active wafer. The final thickness of the stack can be very thin.
Delete3D sensors only means two layers of silicon for the foreseeable future.