TSMC Wafer Bonding Applications

TSMC patent application US20170186798 "Stacked SPAD image sensor" by Ming-hsien Yang, Ching-chun Wang, Dun-nian Yaung, Feng-chi Hung, Shyh-fann Ting, and Chun-yuan Chen is said to improve SPAD pixel fill factor:

TSMC patent application US20170186796 "Frontside illuminated (FSI) image sensor with a reflector" by Min-feng Kao, Dun-nian Yaung, Jen-cheng Liu, Jeng-shyan Lin, Hsun-ying Huang, and Tzu-hsuan Hsu proposes wafer bonding to add a reflector 102 under the PD 104 to improve FSI pixel QE: