"The consumer 3D sensing module market is expected to reach $8.1B in 2025 from $2B in 2019, according to the “3D Imaging & Sensing 2020” report from Yole Développement. The main driver technologies are Time-of-Flight (ToF) for photography enhancement and Structured Light (SL) for facial recognition. From 2016 to 2019, a total of 22 smartphones integrating a 3D sensing module have been released, 13 with SL and 9 with ToF.
In this dynamic context, System Plus Consulting provides a deep comparative review of technology and cost of 11 3D sensing modules found in flagship smartphones, with a focus on Vertical Cavity Surface Emitting Lasers (VCSELs) and Near Infra-Red CMOS Image Sensors (NIR CIS)."
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