Image Sensors at In-Person Autosens Brussels

Austosens Brussels is to be held in in-person (!!!) on September 15-16. The agenda has been published and includes a lot of image sensor related stuff:

• Sensor technology and safety features to address the challenging needs for reliable and robust sensing/viewing systems
  
  Yuichi Motohasi, Automotive Image Sensor Applications Engineer, Sony
  In this presentation, the key characteristics of the image sensors will be presented. Also, the state-of-the-art of functional safety and cybersecurity requirement to achieve reliable and robust sensing/viewing system will be discussed.
• Beyond the Visible: SWIR Enhanced Gated Depth Imaging
  Ziv Livne, CBO, TriEye
  We will introduce a new and exciting SWIR-based sensor modality which provides HD imaging and ranging information in all conditions (“SEDAR”). How it works, its main benefits, and why it is the future. We will then show experimental evidence of SEDAR superiority over sensors of other wavelengths. These include recordings in difficult conditions such as nighttime, fog, glare, dust, and more. Also, show depth map field results.
• Automotive 2.1 µm High Dynamic Range Image Sensors
  
  Sergey Velichko, Sr. Manager, ASD Technology and Product Strategy, ON Semiconductor
  This work describes a first generation 8.3 Mega-Pixel (MP) 2.1 µm dual conversion gain (DCG) pixel image sensor developed and released to the market. The sensor has high dynamic range (HDR) up to 140 dB and cinematographic image quality. Non-bayer color filter arrays improve low light performance significantly for front and surround Advanced Driver Assistance System (ADAS) cameras. This enables transitioning from level 2 to level 3 autonomous driving (AD) and fulfilling challenging Euro NCAP requirements.
• High Dynamic Range Backside Illuminated Voltage Mode Global Shutter CIS for in Cabin Monitoring
  
  Boyd Fowler, CTO, OmniVision Technologies
  Although global shutter operation is required to minimize motion artifacts in in-cabin monitoring, it forces large changes in the CIS architecture. Most global shutter CMOS image sensors available in the market today have larger pixels and lower dynamic range than rolling shutter image sensors. This adversely impacts their size/cost and performance under different lighting conditions. In this paper we describe the architecture and operation of backside illuminated voltage mode global shutter pixels. We also describe how the dynamic range of these pixels can be extended using either multiple integration times or LOFIC techniques. In addition, how backside illuminated voltage mode global shutter pixels can be scaled, enabling smaller more cost effective camera solutions and results from recent backside illuminated voltage mode global shutter CIS will be presented.
• Chip-scale LiDAR for affordability and manufacturability
  
  Dongjae Shin, Principal researcher, Samsung Advanced Institute of Technology
  In this presentation, we introduce a chip-scale solid-state LiDAR technology promising the cost and manufacturability advantages inherited from the silicon technology. The challenge of the light source integration has been overcome by the III/V-on-silicon technology that has just emerged in the silicon industry. With the III/V-on-silicon chip in the core, initial LiDAR module performance, performance scalability, and application status are presented for the first time. Cost-volume analysis and eco-system implications are also discussed.
• A novel scoring methodology and tool for assessing LiDAR performance
  Dima Sosnovsky, Principal System Architect, Huawei
  This presentation presents a tool, which summarizes the most crucial characteristics and provides a common ground to compare each solution's pros and cons, by drawing a scoring envelope based on 8 major parameters of the LiDAR system, representing its performance, suitability to an automotive application, and business advantages.