The bottom of the first page, in English, it says (c) IEICE. Declaring a copyright is different from open access. Ideally, one should link to the open-access page rather than copy the material and then distribute it. That said, I agree with you that this seems like fair use unless IEICE wants English-language speakers to pay for the English language version.
Meanwhile, I find this paper irritating. While I don't deny Sony's contributions to mass production of BSI (along with TSMC and the people that came up with hybrid stacking - was it Ziptronics?) this paper, like many that come from Sony, are very Sony centric. Looking at the references, they seem to be almost all from Japanese authors, perhaps all Sony authors. Someday I would like to see a more academic paper from Sony that really traces the routes of CIS stacking technology in a fair, balanced, and international way. BSI, of course, comes from vidicon tube days.Stacked devices using indium bump bonds has a long history. And contrary to what is stated in the paper, CIS was quite a viable technology before stacking came along. The paper is "the world according to Sony" like so many other Sony papers and that just continues to be disappointing. As Sony is a leader in the field image sensors, I wish Sony would be less insecure and able to point to contributions from so many others outside the Sony sphere.
I'm afraid this unofficial translated version in public violates IEICE's copyright..
ReplyDeleteThe original paper is in open access. Why do you think that the translated one is copyrighted?
DeleteThe bottom of the first page, in English, it says (c) IEICE. Declaring a copyright is different from open access. Ideally, one should link to the open-access page rather than copy the material and then distribute it. That said, I agree with you that this seems like fair use unless IEICE wants English-language speakers to pay for the English language version.
DeleteMeanwhile, I find this paper irritating. While I don't deny Sony's contributions to mass production of BSI (along with TSMC and the people that came up with hybrid stacking - was it Ziptronics?) this paper, like many that come from Sony, are very Sony centric. Looking at the references, they seem to be almost all from Japanese authors, perhaps all Sony authors. Someday I would like to see a more academic paper from Sony that really traces the routes of CIS stacking technology in a fair, balanced, and international way. BSI, of course, comes from vidicon tube days.Stacked devices using indium bump bonds has a long history. And contrary to what is stated in the paper, CIS was quite a viable technology before stacking came along. The paper is "the world according to Sony" like so many other Sony papers and that just continues to be disappointing. As Sony is a leader in the field image sensors, I wish Sony would be less insecure and able to point to contributions from so many others outside the Sony sphere.