ZyCube and Oki Team on Image Sensor Packaging

EETimes: ZyCube and Oki Electric combine their technologies to offer chip-sized packaging technology for both CMOS and CCD image sensors.

ZyCube 3D CSP will compete with Tessera-Shellcase CSP. Oki seems to be the early adaptor of this package, just like Sanyo was for Shellcase at the time.

On paper ZyCube package looks extremely attractive, albeit a little complex. But the real question is can it compete on price and yield?