EETimes: ZyCube and Oki Electric combine their technologies to offer chip-sized packaging technology for both CMOS and CCD image sensors.
ZyCube 3D CSP will compete with Tessera-Shellcase CSP. Oki seems to be the early adaptor of this package, just like Sanyo was for Shellcase at the time.
On paper ZyCube package looks extremely attractive, albeit a little complex. But the real question is can it compete on price and yield?
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