Toshiba Starts Super-Small Camera Modules Production

Digitimes: Toshiba starts mass production of new very small camera modules at Iwate Toshiba Electronics from January 2008. The ultra-small chip scale camera module (CSCM) that will be the first camera module manufactured with through-chip via (TCV) technology. The modules will be demonstrated at CEATEC Japan 2007 from October 2.

TCV technology reduces wire bonding substrate area by mounting components directly on the wafer and running electrodes through the vias on the circuit board, securing them with balls of solders on the substrate.

Toshiba in-house CMOS camera module production plan and specification overview
Model number	TCM9000MD	TCM9100MD	TCM9200MD
Module size (mm)	4×4×2.5	5.8×6×4.2	6.3×6.4×4.6
Megapixel resolution	0.3	1.3	2
Cell size (micron)	2.2×2.2
Output format	8-bit parallel
Frame rate (fps)	30 (VGA)	15 (SXGA)/ 30 (VGA)	15 (UXGA)/30 (VGA)
Production amount (million)	3	5	1.5
Mass production schedule	Jun-08	Feb-08	Jan-08

Source: Toshiba, compiled by Digitimes, October 2007

Update Feb. 14, 2008:
Datasheetblog nicely organized the information on this with a picture of the new package: