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Monday, July 08, 2024

Albert Theuwissen lecture on CIS stacking technology












 


3 comments:

  1. very cool summary, thanks! for slide 10 - Sony already presented the next gen, where the contact/pixel pitch is shrinked to 3.45um. One remarkable thing of page 10 is - its not just a stack, the 2 components are made of different material - InGaAs and Si. A further example of a stacked sensor was presented recently: the sensor of a new Nikon camera where readout elecronics is stacked beside the the pixel array.

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  2. This is great, thanks for posting this and to Albert for sharing

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  3. Thanks to Albert for making available this material !

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