very cool summary, thanks! for slide 10 - Sony already presented the next gen, where the contact/pixel pitch is shrinked to 3.45um. One remarkable thing of page 10 is - its not just a stack, the 2 components are made of different material - InGaAs and Si. A further example of a stacked sensor was presented recently: the sensor of a new Nikon camera where readout elecronics is stacked beside the the pixel array.
very cool summary, thanks! for slide 10 - Sony already presented the next gen, where the contact/pixel pitch is shrinked to 3.45um. One remarkable thing of page 10 is - its not just a stack, the 2 components are made of different material - InGaAs and Si. A further example of a stacked sensor was presented recently: the sensor of a new Nikon camera where readout elecronics is stacked beside the the pixel array.
ReplyDeleteThis is great, thanks for posting this and to Albert for sharing
ReplyDeleteThanks to Albert for making available this material !
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