Thursday, May 24, 2012

UMC Develops BSI CIS Process on 12-inch Wafers

UMC CEO Shih-Wei Sun said at groundbreaking ceremony for its 300mm Fab 12A (Phase 5 & 6) at Tainan, south Taiwan fab complex: "UMC... cooperates closely with customers on 300mm specialty technologies such as... BSI CMOS image sensor... and 3D IC TSV to provide a truly comprehensive, leading foundry technology platform".
Posted by Vladimir Koifman at 22:22

6 comments:

  1. AnonymousMay 25, 2012 at 12:45 AM

    Good news!

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  2. AnonymousMay 25, 2012 at 2:22 AM

    Perfect!

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  3. AnonymousMay 25, 2012 at 2:53 AM

    Who is UMC's major client for these BSI image sensors?

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  4. AnonymousMay 25, 2012 at 2:48 PM

    That is THE good question!

    ReplyDelete
  5. AnonymousMay 26, 2012 at 2:22 PM

    Maybe STM, UMC is the second source of STM for image sensors via its Singapoor Fab.

    ReplyDelete
  6. BaroonMay 27, 2012 at 8:37 PM

    This comment has been removed by the author.

    ReplyDelete

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