Thursday, April 22, 2021

NIT Starts Production of 1.3MP SWIR sensor

NIT NSC1901T-SI sensor has a resolution of 1280×1024 pixels at a pitch of 10um, with a low noise performance of 25e- typ, thanks to its innovative input stage and in pixel CDS.

NSC1901T-SI captures up to 120 fps, operates in IWR and ITR mode, and can be combined with ROI readout. This first member of the SXGA family has a linear response only. The dual-mode Linear and Logarithmic response will be available in Q3-2021.

NSC1901T-SI is manufactured using the advanced NH process developed by NIT. This in-house technology allows the production of hybrid components without using the traditional Indium bump technique leading to high yield manufacturing.

NSC1901T-SI will be integrated first into the NIT SenS camera line – the SenS 1280 camera is due to be out in May 2021.

SILINA - One More Curved Image Sensor Startup

Yole Developpement publishes an interview with  Michael Bailly, CEO of SILINA, a startup developing curved image sensors. Few quotes:

"In nature, most vision systems use curved retinas, like human eyes. Curved retinas offer a wide field of view for an outstanding image quality with only one lens, the crystalline, making the eyes very compact. Unfortunately, all electronic imaging systems use flat imaging sensors. Flat sensors make the lens very complex, using many expensive optical elements. This degrades the optical performance and capabilities of the camera, and increases the mass/volume budget and overall cost of any camera and optical system.

Curved imaging sensors are the next major innovation for the imaging industry, bringing a real paradigm shift in the way we design vision systems. They overcome hardware limitations that no software can solve, and enable a whole new generation of cameras. They bring drastic improvements on four key criteria: increased image quality and detection capability, and reduced cost and bulk of cameras.

First, a pre-processing step makes the sensor flexible and guarantees its good performance. Then, we use specific equipment to curve the sensors, for which we can monitor all the parameters to ensure the process is repeatable and accurate.

In addition, SILINA’s curved sensors can be integrated into the same original packaging as has been developed for traditional flat sensors. This means that the mechanical mount, electronic board and the overall packaging remain the same. It facilitates the integration of the technology into existing production lines. Finally, we curve sensors reliably and at industrial scale for the very first time. We have recently made a demonstrator and curved all the sensors of a single wafer, demonstrating the scalability, repeatability and high yield of our technology.

Finally, we curve sensors reliably and at industrial scale for the very first time. We have recently made a demonstrator and curved all the sensors on a single wafer. A set of 275 curved sensors has been curved at the same time, in less than one hour. This demonstrates the scalability, repeatability and high yield of our technology. These sensors are 1 inch format, like the ones planned to be used in the new generation of smartphone cameras.

The benefits that have been demonstrated in various optical designs include improved image quality and sensitivity. We can offer contrast and sharpness up to 5x better at the image edge for a sharper image with better resolution. We produce a faster lens with higher signal to noise ratio, lower integration time and sharper depth of field. Light transmission is up to 3x better, offering higher performance in low light and again higher signal to noise ratio. Chromatic aberration is reduced by up to 50% for better color rendering and color fidelity. Increased camera field of view improves detection capabilities. Removing vignetting provides better illumination uniformity and better performance in low light.

We also reduce the mass/volume budget. There is up to 50% reduction in the number of optical elements such as lenses and mirrors. The end product is up to 6x lighter and more compact.

Finally we reduce costs. There are fewer and simpler optical elements to manufacture. This releases constraints in optomechanical tolerancing. It makes metrology faster. It also enables faster and easier assembly, integration and alignment."


Wednesday, April 21, 2021

Image Sensors at Autosens Detroit 2021

Autosens Detroit to be held on May 12-13 as an on-line event publishes its agenda with a number of image sensor-related presentations:
  • Sensor Innovation and In-Cabin Intelligence
    Following our purpose to provide freedom to move in a personal and safe way, Volvo Cars is working towards offering a more personal and safer in-cabin experience. This presentation shares our vision of future in-cabin intelligent experience based on innovations of sensor software and hardware, with the aim of enhancing the functions to support drivers and passengers and building an intuitive, safe and natural car-occupant interaction.
    Danilo Neves, Advanced Engineering Leader, Volvo Car Corporation
  • Panel discussion: Extending the limits of CMOS image sensors
    Over recent years we have seen lots of innovation in the different sensor modalities, lidar moving to solid state, radar increasing resolution, cameras building 3D images etc. Also at the edges of performance, we have seen the domain of each sensor become blurred and overlap more. There are specific innovations in what we traditionally call 'image sensors', based on CMOS technology that are extending the capabilities of what could be considered a 'camera' as well. The argument of the discussion is "CMOS camera technology capabilities will broaden sensor capabilities to such an extent to make other sensor modalities redundant".
    Boyd Fowler, CTO, OmniVision Technologies
    Robert Stead, Founder, AutoSens
  • Characteristics of image sensors for precise object detection in automotive ADAS systems
    The number of ADAS systems in the automotive industry using imaging technology is steadily increasing year over year, both for external viewing as well as for in-cabin purposes, to help make vehicles safer for drivers, passengers and pedestrians. Most current commercially available systems are based on CIS technology, but next generation systems are increasingly looking to adapt some level of depth sensing technologies. In this paper we will present which image sensor characteristics are important in order to provide robust and reliable ADAS sensing systems and in-cabin monitoring systems, both from traditional CIS solutions, as well as new ToF and LIDAR depth sensing technologies. We will present analysis based on common available sensor parameters to determine the system level performance, and what it means for object detection probability as well as distance uncertainty for depth sensing solutions. The analysis will include some specific common real world traffic scenarios as well as NCAP scenarios.
    Marius Evensen, Head of Automotive Marketing, Sony
  • Lidar integration for automotive ADAS series production
    Lidar sensors are increasingly becoming important for ADAS in consumer vehicles. This talk will provide some insights on considerations for high performance ADAS lidars and how such lidars can be integrated into vehicles to support the next generation of ADAS functionality.
    Mitch Hourtienne, VP of Business Development, Cepton
  • The human eye as an example for LiDAR
    The performance of the human eye is awesome. It has a fantastic resolution, hence small objects can be seen at long distances. It works very well in a huge brightness dynamic range and it is able to estimate distance. This in a system of two eyes and a dedicated computer system - the human vision system (HVS). There are many aspects of the HVS, which outperforms any LiDAR system. However, the performance is based on a very cleverly designed system. Why not use the human eye and the human vision system as an example for future LiDAR systems?
    Beat de Coi, CEO, ESPROS Photonics
  • The Future of AVs Depends on Non-Stop Vision, Day & Night
    Mr. Levi introduces VISDOM, an automotive-qualified eye-safe (class 1) Camera System with high-speed gated illumination. It can be mounted on the front windshield or integrated into the vehicle headlights, and comes in three configurations for multiple transportation sectors, including cars, trucks, light trains, buses, and robotaxis - offering a range of up to 300M, horizontal FOV from 16 to 60 degrees, and resolution from 800x480 to 2M pixels. VISDOM enables optimal contrast, detection, and recognition required by leading automotive manufacturers and AI perception technologies. Powered by proprietary GatedVision technology protected by 26 patents, VISDOM incorporates an extended-range imaging technology that produces high-contrast images from thousands of micro-exposures per frame with dynamic and variable range slices. GatedVision technology provides a detailed and clear image by accumulating multiple range slices from varying depths into a single clear frame, and can perform background removal to improve contrast by enabling depth-slices of the scene.
    Eyal Levi, Co-Founder, Bright Way Vision
  • No Automated Future Without LiDAR
    As we look to the future of automated driving, there is no single sensor that can do it all. Instead, there is a need for camera, radar and LiDAR sensors, complementing each other's sensing capabilities and creating safety through redundancy. Short-range LiDAR sensors are crucial to negotiate urban environments and traffic jams, while long-range LiDAR sensors enable high speed driving on highways. As a mobility supplier, this highlights some key questions – what technologies are meeting the requirements of automated driving in urban and highway scenarios? What is available now and what should we plan for later introduction? How can we deliver the right technology mix in a way that is affordable? While it will be a race to see who can drive down the cost of LiDAR, Continental’s perspective is clear: Safe autonomous mobility requires LiDAR technology – with the right performance-to-cost ratio – to address existing corner cases unsolvable by camera and radar solutions.
    Gunnar Juergens, VP and Head of LiDAR Segment, Continental
  • Detecting the “Invisible”: Designing Cameras for Challenging ADAS/AV Computer Vision Edge Cases
    Dave Tokic, VP Marketing & Strategic Partnerships, Algolux
  • Leading Edge Sensor Innovations for ADAS and Avs
    This session will include an overview presentation from Dr Khasha Ghaffarzadeh, Chief Technology Analyst, AutoSens Research, to present the hottest innovation areas, and companies to watch in 2021. This will be followed by a panel discussion between leading innovators from SWIR, LiDAR, Radar, and Camera.
    Khasha Ghaffarzadeh, Chief Analyst, AutoSens Research

SWIR/NIR QD/2D Sensor Presentations

TechBlick's on-line conference "Printed, Hybrid, Structural & 3D Electronics Quantum Dots: Material Innovations & Commercial Applications" on May 11-12, 2021 has 5 presentations on image sensors:

  • Fraunhofer FEP | Organic-on-CMOS Photodetectors for NIR/SWIR Sensing
  • Emberion | Hybrid CMOS SWIR Cameras
  • IMEC | High Pixel Density Infrared Sensors Enabling Augmented Vision
  • SWIR Vision Systems | Commercial High Resolution Quantum Dot SWIR Cameras for Industrial Imaging Markets
  • University of Cambridge | State-of-the Art and Future Prospects for 2D Materials and Graphene in Photosensing

Prophesee Event Driven Sensors Presentations

Prophesee publishes 3 presentations at HannoverMesse site: 1, 2, 3. Few slides from the presentations:

Tuesday, April 20, 2021

Sony Fab 5 Starts Wafer Production

Sony Semiconductor Solutions announces that, starting in April 2021, it has begun operations on the production lines at the new fab built on the premises of Nagasaki Technology Center (“Nagasaki TEC”), a production center owned by Sony Semiconductor Manufacturing Corporation. The new fab, dubbed “Fab 5,” will be utilized for the mass production of CMOS sensors.

Nagasaki TEC serves as a production center for CMOS image sensors for smartphones, the main product line within Sony’s Imaging & Sensing Solutions business. Going forward, Sony Semiconductor Solutions plans to expand production facilities at Fab 5 in line with market trends.

Mobileye L4 Self-Driving Solution Uses 13 cameras, 9 LiDARs, and 6 Radars

Intel-Mobileye announces that its latest Mobileye Drive Level 4 self-driving system is commercially available for a variety of autonomous-vehicle customers. The system features True Redundancy that combines two independent perception sub-systems – one powered by cameras, another by radar and LiDAR – each capable of supporting full end-to-end autonomous capabilities.

Smartsens Demos its Voltage Domain Global Shutter Sensor

Smartsens publishes two videos demoing its 9MP SC910GS sensor:

Monday, April 19, 2021

Inivation's Sensor Becomes the First Event-Driven Sensor in Space

IniVation's DAVIS240C vision sensor has become the world’s first ever neuromorphic technology to reach space.

The sensor included in the custom payload was part of the UNSW Canberra Space’s M2 CubeSat satellite, which was successfully launched with Rocket Lab’s ‘They Go Up So Fast’ mission from New Zealand earlier this month.

The mission, a collaboration between Western Sydney University’s International Centre for Neuromorphic Systems (ICNS), UNSW Canberra Space and the Royal Australian Air Force (RAAF), brings together emerging technologies that deliver advanced capabilities in Earth observation, maritime surveillance, and satellite communications.

Dr. Kynan Eng, CEO and co-founder at iniVation, emphasized both the ground-breaking possibilities and the collaborative nature of the mission. He said, “As a company focused on ultimate machine vision performance in challenging, power-limited environments, space is about as hard as it gets. We are very excited to see our technology taking the first small steps towards supporting long-term human activities in space.

Samsung Austin Fab Power Outage Impacted CIS Production, More Production News

IFNews, TrendForce: The Line S2 fab of Samsung in Austin, Texas sustained a power interruption, which has forced it to suspend operation since mid-February, under the impact from the winter storm. TrendForce’s latest investigations indicate that the capacity utilization rate for the entire fab is not expected to climb back to over 90% until the end of March.

According to TrendForce’s investigations, Samsung was able to prepare for the power interruption ahead of time as the company had been forewarned by the local utility. Hence, the loss of WIP (work in progress) wafers caused by the incident was minimal. However, the delay in the resumption of full operation at the plant is expected to last more than two weeks, during which the fab will suspend its wafer input.

CIS logic chips and OLED display drivers are a bulk of 28nm production at the Austin fab, according to Omdia:


According to Omdia, GalaxyCore, OminiVision, and SK Hynix increase prices of their 2MP, 5MP, 8MP and 12MP sensors by 15-20% in 2Q21 due an ongoing shortage of the 8-inch fab capacity: