Friday, February 12, 2016

IMEC Presents Lens-Free Microscope

IMEC presents a lens-free microscope for large field-of-view live imaging at micrometer resolution. Its key benefits include super-large field-of-view at micrometer resolution and a compact and modular design. In a lens-free digital microscope, images are captured on a CMOS sensor, and digitally reconstructed using software. Imec’s lens-free microscope features a comparable micrometer-scale accuracy as traditional optical microscopes. While being much smaller and less expensive, imec’s microscope captures a larger field-of-view in one shot, enabling shorter sample processing times. The lens-free microscope paves the way to new applications with living cells and tissues.


Imec’s lens free imaging solution is now available as a full, ready-to-use demo kit evaluation system including a light source, image sensor, control and read-out electronics and a software interface,” stated Jerome Baron, business development manager of integrated vision systems at imec. “Companies can use it to try out their own applications, supported by our engineers to fine-tune the hardware and software and customize the systems toward their exact application requirements.

Thursday, February 11, 2016

Omnivision Samples RGB-Ir Sensor for Biometric Applications

PRNewswire: OmniVision announces the OV2744, a 1.4um PureCel sensor featuring its second-generation RGB-Ir technology which delivers quality IR output without compromising RGB images. The OV2744 targets biometric applications such as facial recognition for front-facing cameras in notebooks, tablets and smartphones.

"Notebook and mobile device OEMs have traditionally relied on two-camera solutions for image capturing and facial recognition functionalities," said Arun Jayaseelan, product marketing manager at OmniVision. "The OV2744 is capable of delivering both premium RGB imaging and high quality IR information required for biometric and other emerging IR applications. The OV2744 thus gives OEMs the opportunity to move to single camera solutions, thereby reducing cost and space requirements for their devices."

The OV2744 is said to have less color aliasing than competing RGB-Ir sensors that are currently available in the market.

The OV2744 captures 1080p video at 60fps while consuming less power than any other 1080p sensor currently on the market. The 1/6-inch OV2744 supports full frame staggered high dynamic range and features an ultra-low power mode, which reduces the resolution and frame rates to conserve additional power.

The OV2744 is currently available for sampling and is expected to enter volume production in Q1 2016.

Qualcomm Low-End AP Supports 16MP Camera

Qualcomm announces its mid-range and low-end SnapDragon mobile processors: 625, 435, and 425. Even the lowest cost 425 model features dual ISP and 16MP imaging support:

Monday, February 08, 2016

Read Noise: e- vs uV

Albert Theuwissen reviews ISSCC 2016 Sensor Noise Forum and compares different ways of read noise reporting, based on Neale Dutton's presentation.

ISSCC Review - Part 3

Albert Theuwissen concludes his ISSCC review with NHK/Shizuoka Univ./Brookman 33MP, 1.1um pixel sensor for 8K UHDTV, and FBK SPAD imager that only reacts when a pre-set number of photons is registered by a pixel.

Saturday, February 06, 2016

Image Sensor Conference in Japan

Technical Group on Information Sensing Technologies (IST), the Institute of Image Information and Television Engineers (ITE), holds an image sensor conference at NHK Lab facilities, Tokyo, Japan, on March 11, 2016. Participation is free of charge, no prior registration is required. The IST conference proceeding is about 1000-2000 yen. The agenda of the conference is full of interesting presentations:

  • Invited Talk: Low-Noise Image Sensors
    Shoji Kawahito (Shizuoka Univ.)
  • Multi-storied photodiode CMOS image sensor for multiband imaging with 3D technology
    Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Toru Kondo, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus)
  • A CMOS Image Sensor Using Multiple Tap Lateral-Electric-Field Charge Modulators for Time-of-Flight Range Imaging
    Taichi Kasugai, Sang-Man Han, Hanh Trang, Taishi Takasawa (Shizuoka Univ.), Satoshi Aoyama (Brookman Tech.), Keita Yasutomi, Keiichiro Kagawa, Shoji Kawahito (Shizuoka Univ.)
  • Stacked Image Sensor Using Chlorine-doped Crystalline Selenium Photoconversion Layer Composed of Size-controlled Polycrystalline Particles
    Shigeyuki Imura, Kazunori Miyakawa, Hiroshi Ohtake, Misao Kubota, Kenji Kikuchi (NHK), Toru Okino, Yutaka Hirose, Yoshihisa Kato (Panasonic), Nobukazu Teranishi (University of Hyogo)
  • A 1280x720 single-photon detecting image sensor with 100dB dynamic range using a sensitivity boosting technique
    Manabu Usuda, Yusuke Sakata, Seiji Yamahira, Shigetaka Kasuga, Mitsuyoshi Mori, Yutaka Hirose, Yoshihisa Kato, Tsuyoshi Tanaka (Panasonic AIS)
  • A 1.1μm 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters
    Toshiki Arai, Toshio Yasue, Kazuya Kitamura, Hiroshi Shimamoto (NHK STRL), Tomohiko Kosugi, Sungwook Jun, Satoshi Aoyama (Brookman Technology), Ming-Chieh Hsu, Yuichiro Yamashita (TSMC), Hirofumi Sumi (The University of Tokyo), Shoji Kawahito (Shizuoka University)
  • Visualization of Ultra High-Speed Phenomena by 10 Mfps Ultra High-Speed Camera with Improved Photosensitivity of ISO 16000
    Manabu Suzuki, Masashi Suzuki, Fan Shao, Rihito Kuroda (Tohoku Univ.), Nobuyuki Tokuoka, Yasunori Kawaguchi, Hideki Tominaga (Shimadzu), Shigetoshi Sugawa (Tohoku Univ.)
  • An APS-H size 250Mpixel CMOS Image Sensor Using Column Signal ADCs with Dual Gain Amplifiers
    Takashi Muto, Hirofumi Totsuka, Toshiki Tsuboi, Daisuke Yoshida, Yasushi Matsuno, Masanobu Ohmura, Hidekazu Takahashi, Katsuhito Sakurai, Takeshi Ichikawa, Hiroshi Yuzurihara, Shunsuke Inoue (Canon)
  • A 1.2e- Temporal Noise 3D-Stacked CMOS Image Sensor with Comparator-Based Multiple Sampling PGA
    Kei Shiraishi, Yasuhiro Shinozuka, Tomonori Yamashita, Kazuhide Sugiura, Naoto Watanabe, Ryuta Okamoto, Tatsuji Ashitani, Masanori Furuta, Tetsuro Itakura (Toshiba)
  • An 18M-pixel CMOS Image Sensor Using 12-bit Column-Parallel Single-Slope ADCs with Operation-Period-Reduced Time-to-Digital Converters
    Yoshio Hagihara, Yusaku Koyama, Takanori Tanaka, Atsuko Kume, Yosuke Kusano, Mai Arita, Masashi Saito, Yoshihisa Okada (Olympus)
  • High-Speed Range Finding using Smart Image Sensor
    Daisuke Uehara, Makoto Ikeda (UTokyo)
  • CMOS Biosensor IC Focusing on Dielectric Relaxations of Biological Water with 120GHz and 60GHz Oscillator Arrays
    Takeshi Mitsunaka, Akira Saito, Nobuyuki Ashida, Kunihiko Iizuka (SHARP), Tetsuhito Suzuki, Yuichi Ogawa (Kyoto Univ.), Minoru Fujishima (Hiroshima Univ.)
  • Device Simulations for Ultrahigh-Speed and High-Voltage Image Sensors
    Hideki Mutoh (Link Research)
  • Color Image Sensor with Three-stacked Organic Photoconductive Films
    Toshikatsu Sakai, Hokuto Seo, Tomomi Takagi, Misao Kubota, Hiroshi Ohtake (NHK), Mamoru Furuta (Kochi Univ. of Tech.)
  • Organic-Photoconductive-Film CMOS Image Sensor -- 120dB Wide-Dynamic-Range,Photoelectric conversion controlled Global Shutter --
    Masashi Murakami, Kazuko Nishimura, Sanshirou Shishido, Masayuki Takase, Yasuo Miyake, Tokuhiko Tamaki, Yoshihiro Sato, Yasunori Inoue (Panasonic)

Thanks to RK for the info!

2016 ISSCC Review, Part 2

Albert Theuwissen publishes the second part of his ISSCC review. This part covers CMOSIS 391MP sensor and Canon 250MP APS-H imager, as well as Toshiba and TSMC papers.

Friday, February 05, 2016

EVG Joins European Wafer Stacking Program

EV Group (EVG) joins the 3D integration consortium of IRT Nanoelec headed by CEA-Leti and includes STMicro and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.

Séverine Chéramy, director of the 3D integration program of IRT Nanoelec, said the consortium expects to achieve an interconnection pitch of about 1µm.

"Wafer-to-wafer stacking using direct Cu-to-Cu bonding is key for advanced 3D technologies, specifically for imaging application and 3D partitioning," Chéramy said. "EVG's knowledge on bonding will leverage the process expertise of the original members. The participation of EVG in the consortium will create new opportunities and optimized and cost-effective solutions for 3D IC devices."

Albert Theuwissen Reviews Panasonic ISSCC Papers

Albert Theuwissen publishes a review of Panasonic organic sensor papers presented at ISSCC 2016 this week. This is the first part of his ISSCC review.