Yet Another Tessera Shellcase Article

Tessera seems to spend a lot off efforts to rise awarness of its Shellcase packaging. This time Electronic Design publishes an article about the new genaration RT package.
RT is the new generation CSP package with following improvements:

• RT family employs a thin polymer on one side of the chip—instead of the previous two-sided glass sandwich.
• 0.5-mm package profile, compared to the 0.9 mm of the old OC family.
• Package height (excluding the BGA) is about 400 µm, ±25 µm.
• Scribe-line widths are reduced from 260 and 250 µm down to 100 µm.
• Bond pad sizes dropped from 150 by 50 µm to 70 by 50 µm.
• Bond pad pitch was reduced from 350 to 180 µm.