Yahoo: Dongbu announced that it has begun shipping 2MP sensors to SETi. The new chips, processed at the 110nm node, will target primarily 2MP camera phones in developing nations. Dongbu plans for shipping 3- and 5MP versions to SETi by early next year. These future higher resolution versions, also processed at the 110nm node, will deploy a smaller pixel size to compete head on with 90nm-node CIS chips.
According to Joon Hwang, EVP of Dongbu HiTek, “Price competition for CIS chips is getting fiercer, especially in the Chinese market. To sharpen our competitive edge, we are maximizing useful die per wafer by driving the highest quality levels and minimizing the chip size.” He disclosed that the Dongbu technologists are making good progress toward shrinking the size of the pixel to 1.4um, which will enable its 110nm-node CIS chips to compete directly with 90nm-node CIS chips.
Dongbu has drawn up plans to serve a broader range of applications such as image sensors for vehicles and CCTVs. The company expects to continue investing in R&D to improve CIS image quality and eventually license its CIS IP to qualified fabless firms worldwide.