Electrons and Holes blog posted the link to the materials presented at Workshop on Vertically Integrated Pixel Sensors - VIPS 2010, held on April 22-24, 2010 in Pavia, Italy. While the workshop mostly concentrates of radiation and particle detectors, it has few presentations showing interesting current and future works coming from 3D integration:
IMEC slides show 3D integration roadmap:
If/when 1 TSV per group of pixels approach is adapted, it would completely redefine the speed and noise trade-offs in the future sensors. The image processing pipeline might be lagging though.
Another slide presents IMEC work on crosstalk reduction in BSI sensors:
Yet another IMEC slide talks about backside passivation trade-offs:
Fraunhofer Instutute together with Berlin University presented quite impressive photos of wafer-level cameras:
ST too presented its WLC packaging and process: