Monday, August 31, 2015
PRNewswire: EV Group (EVG) announces that the company is experiencing strong demand for its automated 300-mm polymer adhesive wafer bonding systems. Over the past 12 months, the company's order intake has doubled for these systems, including the EVG560, GEMINI and EVG850 TB/DB series of wafer bonders, includes multiple orders from foundries and outsourced semiconductor assembly and test providers headquartered in Asia. Much of the increase in demand is being fueled by advanced packaging manufacturers ramping up production of CMOS image sensors with TSV interconnects.
Posted by Vladimir Koifman at 20:53