Systemplus publishes a reverse engineering report on the dual camera module extracted from Huawei P9 smartphone:
"The P9 camera module, with dimensions of 18 x 9.2 x 5.1mm, is equipped with two sub-modules each including a Sony CIS, a closed loop voice coil motor (VCM) and a 6-element lens. Doubling the number of cameras gives more light, vivid colors and crisper details. Moreover, it compensates for the fact that the module is provided without optical image stabilization (OIS). The CISs are assembled on a copper metal core 4-layer PCB using a wire bonding process. An external image processor chip is present on the phone’s printed circuit board (PCB)."
Another Systemplus report talks about I3system's Thermal Expert camera for smartphones:
"The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 6 times the resolution of the FLIR Lepton 3. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer."