Thursday, July 11, 2019

UTAC Automotive Sensor Packages

UTAC paper "CMOS Image Sensor Packaging Technology for Automotive Applications" by Teoh Eng Kang, Alastair Attard, and Jonathan Abela says "Whereas high reliability image sensor packages are typically based on ceramic packages, these tend to have considerably higher costs and longer development cycles than laminate-based packages which are normally used in other market segments. In this paper, we present novel methods for packaging image sensors on laminate substrates, enabling a reduction in cost, form factor and time-to-market whilst simultaneously meeting automotive reliability grades typically required for such devices."

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