Link: https://www.techinsights.com/blog/samsung-unveils-first-imager-featuring-hybrid-bond-technology
In a recent breakthrough discovery by TechInsights, the Samsung GM5 imager, initially thought to be a standard back-illuminated CIS, has been revealed to feature a pioneering hybrid bond design. This revelation comes after a year-long investigation following its integration into the Google Pixel 7 Pro.
Initially cataloged as a regular back-illuminated CIS due to the absence of through silicon vias (TSVs), further analysis was prompted by its appearance in the Google Pixel 8 Pro, boasting remarkable resolution. This led to an exploratory cross-section revealing the presence of a hybrid bond, also known as Direct Bond Interconnect (DBI).
Is it just me or is it strange to refer to reverse engineering as a "breakthrough discovery"? And is DBI such a surprise in 2025? Maybe I am missing something here.
ReplyDeleteI think this was reported in March 2024. Google Pixel 8 pro was released in Oct 2023.
DeleteGoogle Pixel 7 was released in 2022, not so new. It may be the first Samsung product using DBI.
DeleteDo they pay to ZiBond?
ReplyDelete