Advanced Packaging and Multi-Dimensional Systems Integration for Image Sensors
November 5 & 6, 2026
Antwerp, Belgium
Abstract
Packaging technology for image sensors is an underappreciated issue in the systems integration process, greatly affecting performance, scalability, physical area, and cost. The multi-dimensional package as well as the underlying technology can greatly affect the overall electrical, optical, mechanical, and thermal characteristics of the integrated system. These systems have become multi-dimensional in nature, composed of several interacting layers and multiple sensors with the imagers vertically integrated within the overall system. Now that image sensors are driven more than ever to extreme performance capabilities, novel packaging options and technologies have become increasingly important. An important trend to support large scale sensors integrated into systems are the widely applied stacking and chiplet technologies in which several layers of active silicon are placed above each other. In this way, highly compact, high performance imaging systems are becoming possible. Packaging of systems including image sensors has become much more than placing a single silicon die into a package and attaching some wires.
The landscape of image sensor applications is widening at an accelerating rate, requiring new and different packaging solutions. This forum will review this key issue as well as include a series of highly related topics. This year’s Harvest Imaging Forum is focusing on the existing field of multi-dimensional packaging technology for image sensors. Related topics such as on-chip interconnect, power delivery, synchronization, network communication, thermal behavior, and heterogeneous integration will also be discussed. The focus will be on both current and near term capabilities. These next generation technologies are now becoming available, allowing the development and integration of large scale systems composed of multiple layers and chiplets to produce large scale systems operating at increasingly higher levels of performance.
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