Caeleste publishes its paper "Photon-to-Photon CMOS Imager: Opto-Electronic 3D Integration" presented at Image Sensors America conference in October 2017 by Gaozhan Cai. The paper presents an ambitious project of integrating a fiber optics interface to improve speed of a fast stacked image sensor:
We called this readout architecture "cluster parallel" for the past few years, at least the sensor and readout part, not the optical interconnect part. Although, modulated optical output was something we thought would be interesting for cryogenic arrays back in 1993. doi:10.1117/12.169726 As long as there are no light emitters in the focal plane array, it could be low power readout. I like it!
ReplyDeleteThe rotating FLIR used by US Army was also a photon-to-photon device. This principle was proposed by Smart Dust for low power free space opto-com.
ReplyDelete-yang ni
There’s a wrong information on page 4. CMOS BSI image sensor was first commerlized by OmniVision with Apple in iPhone, not by SONY.
ReplyDeleteOmnivision was first to announce consumer-grade BSI samples and demos. Sony was able to come first with an actual product on the market:
Deletehttp://image-sensors-world.blogspot.com/2009/01/sony-bsi-sensor-in-products.html
SONY's first BSI image sensor is half baked solution. The sensitivity is only 50% improvement. The real BSI image sensor is twice more sensitive,
Deleteno way this could work with rolling shutter pixel. Not with the proposed "tiles" at least
ReplyDelete