Image Sensors World
News and discussions about image sensors
Monday, January 05, 2026
Eric Fossum receives 2026 IEEE Nishizawa Medal
Thursday, January 01, 2026
Conference List - June 2026
SPIE Photonics for Quantum - 8-11 June 2026 - Waterloo, Ontario, Canada - Website
AutoSens USA 2026 - 9-11 June 2026 - Detroit, Michigan, USA - Website
Sensor+Test - 9-11 June 2026 - Nuremberg, Germany - Website
Smart Sensing - 10-12 June 2026 - Tokyo, Japan - Website
IEEE/JSAP Symposium on VLSI Technology and Circuits - 14-18 June 2026 - Honolulu, Hawaii, USA - Website
International Conference on Sensors and Sensing Technology (ICCST2026)- 15-17 June 2026 - Florence, Italy - Website
International Conference on IC Design and Technology (ICICDT) - 22-24 June 2026 - Dresden, Germany - Website
Automate 2026 - 22-25 June 2026 - Chicago, Illinois, USA - Website
27th International Workshop on Radiation Imaging Detectors - 28 June-2 July 2026 - Ghent, Belgium - Website
If you know about additional local conferences, please add them as comments.
Return to Conference List index
Friday, December 26, 2025
Prophesee leadership change
Prophesee Appoints Jean Ferré as Chief Executive Officer to Lead Event-based Vision Sensing Pioneer in Next Stage of Growth
Paris, France – December 23, 2025 – Prophesee, a pioneer and global leader in event-based vision technology, today announced the appointment of Jean Ferré as Chief Executive Officer. He has been designated by the board to succeed Luca Verre, Prophesee’s co-founder and former CEO, who is leaving the company. This leadership transition comes as the company enters a new phase of commercialization and growth, building on a strong technological and organizational foundation and welcoming new investors. The company is sharpening its near-term focus on sectors with high value use cases demonstrating today the strongest demand and adoption momentum such as security, defense and aerospace, as well as industrial automation. Prophesee will continue to support volume vision-enabled applications markets where it has achieved initial commercial success such as IoT, AR/VR, consumer electronics.
[...]
Full press release is available here: https://www.prophesee.ai/2025/12/23/prophesee-appoints-jean-ferre-as-chief-executive-officer-to-lead-event-based-vision-sensing-pioneer-in-next-stage-of-growth/
Wednesday, December 24, 2025
MagikEye's real-time 3D system at CES
MagikEye to Showcase New High-Resolution Real-Time 3D Evaluation System at CES
Reference platform delivers with >8000 points in a 3D cloud at 30 FPS for robotics, low-cost LiDAR, and automotive in-cabin deployments
STAMFORD, Conn.--(BUSINESS WIRE)--Magik Eye Inc (www.magik-eye.com), a developer of advanced 3D depth sensing based on its ILT™ (Invertible Light Technology), will be showcasing a new high-resolution, real-time ILT evaluation system at the upcoming Consumer Electronics Show. The system is designed to help customers evaluate ILT performance, validate configurations, and begin application development for robotics, low-cost LiDAR-class replacement, and automotive in-cabin applications.
The new evaluation system is a reference implementation, not a commercial sensor product. It delivers an approximately over 8,600-point 3D point cloud per frame at 30 frames per second, corresponding to more than 259,000 depth-points per second, while maintaining real-time operation and low latency (~33 ms). This represents roughly 2× the spatial point density of MagikEye’s prior evaluation platform without sacrificing frame rate.
“Customers evaluating depth sensing technologies want realistic, real-time data they can actually build on,” said Skanda Visvanathan, VP of Business Development at MagikEye. “This reference system is designed to shorten the path from evaluation to application development by delivering higher-resolution ILT depth at a full 30 FPS, in a form factor and performance envelope aligned with embedded systems.”
Designed for real-world evaluation and development, the evaluation system enables customers to evaluate ILT depth sensing in their own environments, begin application software development using live 3D point cloud output, and validate specific ILT configurations—including field of view, operating range, optical setup, and processing pipeline—prior to custom module design.
Key characteristics of the evaluation platform include a wide 105° × 79° field of view, a wide operating range of 0.3 m to 2 m (with support for near-field proximity use cases), and operation in bright indoor lighting conditions of up to ~50,000 lux, dependent on distance and target reflectance.
Unlike depth solutions that increase point density by reducing frame rate, MagikEye’s ILT evaluation system maintains a full 30 FPS, enabling depth perception suitable for dynamic, real-time environments. ILT™ can scale to even higher frame rates with increased processing performance.
At CES, MagikEye will demonstrate how the evaluation system supports development and prototyping across robotics applications such as real-time perception and navigation, low-cost LiDAR-class embedded sensing, and automotive in-cabin occupancy and interior monitoring.
The evaluation system integrates with MagikEye’s MKE API, allowing customers to stream point clouds and integrate ILT depth data into existing software stacks.
MagikEye will be showcasing the new evaluation system at CES in Las Vegas. To schedule a meeting or request a demonstration, please contact ces2026@magik-eye.com.
Monday, December 22, 2025
AZO Sensors interview article on Teledyne e2v CCD imagers
The Enduring Relevance of CCD Sensors in Scientific and Space Imaging
(Inteview with Marc Watkins, Teledyne e2v)
While CMOS technology has become the dominant force in many imaging markets, Charge-Coupled Devices (CCDs) continue to hold an essential place in scientific and space imaging. From the Euclid Space Telescope to cutting-edge microscopy and spectroscopy systems, CCDs remain the benchmark for precision, low-noise performance, and reliability in mission-critical environments.
In this interview, Marc Watkins from Teledyne e2v, discusses why CCD technology continues to thrive, the company’s long-standing heritage in space missions and scientific discovery, and how ongoing innovation is ensuring CCDs remain a trusted solution for the most demanding imaging applications.
To begin, could you provide an overview of your role at Teledyne e2v and the types of imaging applications your team typically supports?
I manage the CCD product portfolio and associated sales globally. Our CCDs are mostly used in scientific applications such as astronomy, microscopy, spectroscopy, in vivo imaging, X-ray imaging, and space imaging. Almost every large telescope worldwide uses our CCDs for their visible light instruments.
CCDs are vital for medical research, especially for in vivo preclinical trials in areas such as cancer research. Advanced microscopy techniques such as Super Resolution Microscopy require the extreme sensitivity of EMCCDs. Not all CCDs are hidden in labs, on top of mountains, or in space; you’ll likely have passed a CCD in airport security without realising it.
In a time when CMOS technology has become dominant in most imaging markets, what are the primary reasons CCD sensors still maintain relevance in scientific, astronomical, and space-based applications?
We observe that in many markets, CMOS has made significant advances; however, CCDs remain the best overall solution for many niche applications, such as the ones I just described. The technical advantages vary greatly between applications.
Could you elaborate on some of the technical advantages CCD sensors offer over CMOS in high-performance or mission-critical imaging environments?
CCDs are great for long integrations where larger charge capacities, higher linearity, and low noise provide the best performance. They can be deeply cooled, making dark noise negligible. CCDs can be manufactured on thicker silicon, which gives better Red/near-infrared sensitivity. CCD pixels can be combined or “binned” together noiselessly, a technique widely used in spectroscopy. Specialized “Electron Multiplying” CCDs are sensitive enough to count individual photons.
What are some of the unique requirements in space or astronomy applications that make CCDs a more suitable choice than CMOS?
Most astronomy applications use very long integration times, require excellent Red/NIR response, and have no problem cooling to -100 °C, making CCDs a much better solution.
For space, the answer can be as simple as our mission heritage, making them a low-risk option. Since 1986, Teledyne’s sensors have unlocked countless scientific discoveries from over 160 flown missions. Our CCDs can be found exploring the deep expanses of space with the Hubble and Euclid Space Telescopes, imaging the sun from solar observatories, navigating Mars with rovers, and monitoring the environment with the Copernicus Earth observation Sentinel satellites.
As CMOS technology continues to advance, are you seeing any significant closing of the performance gap in areas where CCDs have traditionally been stronger, such as low noise, uniformity, or quantum efficiency?
For most of our applications, recent advances in CMOS technology have had little impact on the CCD business. An example of this might be the development of improved high-speed CMOS. If high speed is critical, then CMOS is already the incumbent technology. Where quantum efficiency is concerned, we can offer the same backthinning and AR coatings for both CCD and CMOS technologies, with a peak QE of up to 95 %.
One area of transition for us is in space applications, such as Earth observation, where improvements in areas such as radiation hardness, frame rate, and TDI are steering many of our customers from our CCD to our CMOS solutions.
How has Teledyne e2v continued to innovate or evolve its CCD product lines to meet the demands of modern applications while CMOS continues to gain market share?
Our CCD product lines have a long development heritage. In general, we aim to optimize existing designs by tailoring specifications, such as anti-reflective coatings, to benefit specific applications. With in-house sensor design, manufacture, assembly, and testing, all our CCDs can be supplied partially or fully customized to fit the application and achieve the best possible performance.
Our CCD wafer fab and processing facility in England was established in 1985 and quickly became the world’s major supplier for space imaging missions and large ground-based astronomical telescopes. We continue to develop a vertically integrated, dedicated CCD fab and are committed to the development of high-performance, customized CCD detectors.
The CCD fabrication facility is critical to the success and quality of future space and science projects. At Teledyne, we remain committed to being the long-term supplier of high-specification and high-quality devices for the world’s major space agencies and scientific instrument producers.
Are there particular missions or projects, either current or upcoming, where CCD technology remains critical? What makes CCDs indispensable in those scenarios?
A prototype for a new intraoperative imaging technique incorporates CCDs, which we hope will have a significant impact on cancer treatments in the future.
In astronomy, one example is the Vera C. Rubin Observatory, which utilizes an enormous 3.2 Gigapixel camera composed of an array of HiRho CCDs, offering NIR sensitivity and close butting, features not currently available in CMOS technology.
In space, ESA’s recently completed Gaia missions relied completely on the functionality (TDI) and performance of our CCDs. The second Aeolus mission, that will continue to measure the Earth’s wind profiles to improve weather forecasting, uses a unique ‘Accumulation CCD’ which allows noiseless summing of many LIDAR signals to achieve measurable signal levels.
How do you address customer questions or misconceptions around CCDs being considered legacy technology in an industry that often pushes toward the latest advancements?
Consider what is best for your application; it may well be a CCD. You can find our range of available CCDs and their performance on our website, or I would be happy to discuss your application directly. If you would like to speak with me in person, I’ll be attending SPIE Astronomical Telescopes + Instrumentation in July 2026.
Looking ahead, what do you see as the long-term future of CCD sensors within the broader imaging ecosystem? Will they continue to coexist with CMOS, or is the industry moving toward complete CMOS dominance?
The sheer variety of imaging requirements, combined with the continued advantages of CCDs, suggests a long-term demand. We continue to see instruments baselining CCD products into 2030 and beyond.
How does Teledyne e2v position itself within this evolving landscape, and what message would you give to organizations evaluating sensor technologies for specialized imaging applications?
Teledyne e2v solutions are technology agnostic and will recommend what's best for the application, be it CMOS, MCT, or of course CCD.
Friday, December 19, 2025
Singular Photonics and Renishaw collaboration
Singular Photonics and Renishaw Shed New Light on Spectroscopy
Strategic collaboration integrates next-generation SPAD-based image sensor into Renishaw’s new Raman spectroscopy module to allow measurements of highly fluorescent samples
Edinburgh, UK – December 17, 2025 – Image-sensor innovator Singular Photonics today announced a major milestone in its strategic collaboration with Renishaw, a global leader in metrology and analytical instrumentation. The companies have been co-developing next-generation spectroscopy capabilities powered by Singular’s new suite of single-photon avalanche diode (SPAD) image sensors.
Renishaw today revealed the launch of its latest breakthrough in Raman spectroscopy: the addition of Time-Resolved Raman Spectroscopy (TRRS) to its renowned inVia™ confocal Raman microscope. At the core of this innovation is Singular’s Sirona SPAD sensor, enabling researchers and engineers to overcome one of Raman spectroscopy’s most persistent challenges – capturing Raman signals obscured by intense fluorescence backgrounds. With TRRS and Sirona, inVia users can now acquire high-quality Raman spectra from samples previously considered too difficult or impossible to measure.
“We are always on the lookout for new, innovative technology to maintain our lead in this market, and we believe we have achieved this with our partnership with Singular Photonics,” said Dr Tim Batten, Director and General Manager, Spectroscopy Products Division, Renishaw. “Our TRRS solution for the inVia microscope offers customers a multitude of benefits when dealing with highly fluorescent samples, such as those containing pigments. We have had an in-depth collaboration with Singular Photonics dating back to their inception and have been developing this product in tandem with their cutting-edge Sirona SPAD sensor.”
Built on advanced CMOS SPAD architecture, Singular’s Sirona is a 512-pixel SPAD-based line sensor integrating on-chip time-resolved processing and histogramming functionality. This allows simultaneous acquisition of both fluorescence and Raman signals with high temporal precision, unlocking new measurement modalities for scientific and industrial applications.
“By integrating the Sirona sensor into Renishaw’s new TRRS system, they have created a spectrometer that showcases the clear performance advantages of our SPAD technology,” said Shahida Imani, CEO of Singular Photonics. “We’ve built a strong relationship with the Renishaw team since before our spin-out from the University, fostering trust and deep technical collaboration. This partnership opens a significant opportunity to expand our market reach, especially in high-precision scientific and industrial sectors.”
Wednesday, December 17, 2025
Fujifilm color filter optimizations for small pixels
Link: https://www.fujifilm.com/pl/en/news/hq/13164
Fujifilm Launches World’s First Color Filter Material for Image Sensors Compatible with KrF Lithography “WAVE CONTROL MOSAIC™”
PFAS-Free, Contributing to Higher Image Quality in Smartphone Cameras
TOKYO, December 9, 2025 – FUJIFILM Corporation announced the launch of a new color filter material for image sensors, “WAVE CONTROL MOSAIC™*1”, compatible with KrF*2 lithography. This innovative product is the world’s first color filter material for image sensors that supports KrF exposure, and is entirely PFAS-free, addressing environmental and ecological concerns. The new material is designed for use in cutting-edge image sensors requiring ultra-miniaturization and high sensitivity, contributing to higher image quality in smartphone cameras.
Image sensors are semiconductors that convert light into electrical signals to produce images, and are incorporated into devices such as smartphones and digital cameras. In recent years, the range of applications for image sensors has expanded to include automobiles, security equipment such as surveillance cameras, and AR/VR devices. As a result, the image sensor market is expected to grow at an annual rate of approximately 6%*3. With the increasing opportunities for photo and video capture—such as taking pictures and streaming videos shot on smartphones—there is a growing demand for capturing bright and smooth images and videos in any scene, as well as for editing and cropping images after shooting. These trends are driving the need for even higher image quality in image sensors. To achieve higher image quality, it is necessary to miniaturize sensor pixels to create more detailed and high-resolution images. However, as pixels become smaller, the amount of light that can be captured decreases, resulting in lower sensitivity—a key challenge in image sensor development.
The newly launched product in Fujifilm’s WAVE CONTROL MOSAIC™ is the world’s first color filter material for image sensors compatible with KrF lithography, enabling the formation of finer pixels that was previously unattainable with conventional i-line*4 exposure. Building on its expertise in functional molecule design and organic synthesis cultivated through silver halide photographic R&D, Fujifilm has developed new additives optimized for KrF exposure and a proprietary dye with outstanding heat and light resistance. In addition, through our unique formulation technology, the company combined this newly developed dye with conventional pigments to increase light transmittance and compensate for the reduction in light caused by pixel miniaturization, resulting in a color filter material that achieves both miniaturization and high sensitivity. With this new product, users can capture bright, smooth images and videos in various scenes.
Furthermore, the product is PFAS-free*5, containing no per- or polyfluoroalkyl substances, which are of increasing environmental concern. Fujifilm has long been committed to reducing and replacing substances that pose potential risks to human health and the environment, having previously developed PFAS-free negative-tone ArF immersion photoresists and nanoimprint resists. Building on the PFAS-free technology established through this product, Fujifilm will extend these efforts to all WAVE CONTROL MOSAIC™ materials and photoresists*6, accelerating the transition of its semiconductor materials portfolio to PFAS-free solutions.
As a leading manufacturer of color filter materials for image sensors, Fujifilm will continue to develop materials that not only enhance image quality but also enable applications such as infrared photography for low-light environments. Under the concept of “Transforming the invisible world into the visible, delivering new vision and value to society,” Fujifilm remains committed to contributing to the expansion of the image sensor market.
*1 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.
*2 KrF (Krypton Fluoride): A 248nm wavelength laser light source used in the photolithography process for semiconductor manufacturing.
*3 Source: Techno System Research, “2025 First Half Edition CCD & CMOS Market Marketing Analysis.”
*4 i-line: A mercury spectral line with a wavelength of 365nm, also used as a light source in photolithography processes.
*5 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.
*6 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.
Monday, December 15, 2025
Intelligent SPAD Sensor [PhD Thesis]
Thesis title: "SPAD Image Sensors with Embedded Intelligence"
Yang Lin, EPFL (2025)
Abstract: Single-photon avalanche diodes (SPADs) are solid-state photodetectors that can detect individual photons with picosecond timing precision, enabling powerful time-resolved imaging across scientific, industrial, and biomedical applications. Despite their unique sensitivity, conventional SPAD imaging workflows passively collect photons, transfer large volumes of raw data off-chip, and reconstruct results through offline post-processing, leading to inefficiencies in photon usage, high latency, and limited adaptability. This thesis explores the potential of embedded artificial intelligence (AI) for efficient, real-time, intelligent processing in SPAD imaging through hardware-software co-design, bringing computation directly to the sensor to process photon data in its native form. Two general frameworks are proposed, each representing a paradigm shift from the conventional process. The first framework is inspired by the power of artificial neural networks (ANNs) in computer vision. It employs recurrent neural networks (RNNs) that operate directly on timestamps of photon arrival, extracting temporal information in an event-driven manner. The RNN is trained and evaluated for fluorescence lifetime estimation, achieving high precision and robustness. Quantization and approximation techniques are explored to enable FPGA implementation. Based on this, an imaging system integrating a SPAD image sensor with an on-FPGA RNN is developed, enabling real-time fluorescence lifetime imaging and demonstrating generalizability to other time-resolved tasks. The second framework is inspired by the human visual system, employing spiking neural networks (SNNs) that operate directly on the asynchronous pulses generated by SPAD avalanche breakdown upon photon arrival, thereby enabling temporal analysis with ultra-low latency and energy-efficient computation. Two hardware-friendly SNN architectures, Transporter SNN and Reversed start-stop SNN are proposed, which transform the phase-coded spike trains into density-coded and inter-spike-interval-coded representations, enabling more efficient training and processing. Dedicated training methods are explored, and both architectures are validated through fluorescence lifetime imaging. Based on the Transporter SNN architecture, the first SPAD image sensor with on-chip spike encoder for active time-resolved imaging is developed. This thesis encompasses a full-stack imaging workflow, spanning SPAD image sensor design, FPGA implementation, software development, neural network training and evaluation, mathematical modeling, fluorescence lifetime imaging, and optical system setup. Together, these contributions establish new paradigms of intelligent SPAD imaging, where sensing and computation are deeply integrated. The proposed frameworks demonstrate significant gains in photon efficiency, processing speed, robustness, and adaptability, illustrating how embedded AI can transform SPAD systems from passive detectors into intelligent, adaptive, and autonomous imaging platforms for next-generation applications.
Full thesis is available for download at this link: https://infoscience.epfl.ch/entities/publication/c6ecfd11-dd30-4693-a104-c27c66aecad9
Friday, December 12, 2025
Teradyne blog on automated test equipment - part 2
Part 2 of the blog is here: https://www.teradyne.com/2025/12/08/high-throughput-image-sensors-smart-testing-powers-progress/
High-Throughput Image Sensors: Smart Testing Powers Progress
As data streams grow, modern ATE ensures flexible, scalable accuracy
In the race to produce higher resolution image sensors—now pushing beyond 500 megapixels—the industry faces significant challenges. These sensors aren’t just capturing more pixels; they’re handling massive streams of data, validating intricate on-chip AI functions, and doing it all at breakneck speeds. For manufacturers, the challenge is as unforgiving as it is critical: test more complex devices, in less time, all while maintaining or even reducing costs.
Today’s high-resolution sensors must deliver more than just pixel perfection. They must demonstrate pixel uniformity, identify and compensate for defective pixels, verify electrical performance under varying conditions, and prove their resilience under strict power efficiency requirements. As AI functionality becomes integrated with image sensors, testing must also account for new processing capabilities and system interactions.
The move toward higher resolutions introduces not only more data but significant production constraints as well. As sensors grow larger to accommodate more pixels, fewer can be tested simultaneously under the illumination field of automated test equipment (ATE). This site count constraint can be well-handled with strategies for faster data processing and smarter testing. This is where Teradyne plays an important industry role, moving beyond supplier, and stepping in as a strategic partner to help manufacturers redefine what’s possible.
Why High Resolution Means High Stakes
As image sensor resolutions soar—from smartphones to cars to industrial systems—so do data demands. Each leap in resolution extends the volume of data that must be captured and processed, including during testing. For example, a single 50-megapixel image sensor produces around 100 megabytes of data per image. Multiple images, as many as 25 or more, must be captured under different lighting conditions to validate pixel response, uniformity, and defect detection. When multiplied across millions of units, data quickly scales into terabytes for every production batch.
Without innovation, this increase in data threatens to overwhelm production lines. Test times can double or even quadruple, slashing throughput and driving up costs. Manufacturers are left with a critical challenge: how to test sensors faster, without sacrificing accuracy or profitability.
Teradyne Delivers High-throughput, Scalable Solutions
Teradyne addresses these high-stakes dynamics with a combination of powerful, modular hardware and flexible software tools. At the heart of Teradyne’s approach is the belief that high performance and flexibility are essential. The company’s UltraSerial20G capture instrument for Teradyne UltraFLEXplus was built precisely for this moment and is designed to handle the enormous data loads of modern image sensors. It offers a modular architecture that enables manufacturers to respond to new interface protocols without expensive, time-consuming hardware redesigns.
At the same time, Teradyne’s engineers kept the future in focus, looking beyond meeting current requirements by adding future capacity in the UltraSerial20G. Essentially, this provides customers with room to grow without replacing critical hardware. When new protocols emerge or higher data rates become the standard, manufacturers can count on the capabilities of their capture platform. While competitors scramble to keep pace, Teradyne customers are already testing the next generation of devices.
Teradyne also recognizes that hardware is just part of the story. The company’s IG-XL software platform is where this flexibility comes to life. It gives engineers the tools to write custom test strategies at the pin level, controlling everything from voltage and timing to the finest adjustments of signal slopes. Importantly, this software environment allows manufacturers to build and refine their test programs without exposing sensitive intellectual property, a crucial advantage in an industry where secrecy is a competitive necessity.
Overall, Teradyne’s flexible hardware and software architecture offers an integrated approach that enables manufacturers to manage increasing data volumes while maintaining production schedules. Teradyne’s Alexander Metzdorf describes it as giving customers the tools to write their own destiny: “Our role is to provide a toolbox that’s flexible and powerful enough for our customers to test whatever they need—when they need it—without being held back by fixed systems.”
Thursday, December 11, 2025
MRAM forum colocated with IEDM on Dec 11 (today!)
MRAM applications to image sensors may be of interest to our readers.
Masanori Hosomi, Sony - eMRAM for image sensor applications
eMRAM for Image Sensor Applications
Since logic chip size of Sony's image sensor, bonding of pixel wafers and logic wafers, are limited to be equal to or smaller than that of the pixel chip, we have been using DRAM and SRAM while battling the enhancement of image sensor functions and area limitations. To incorporate further functionalities, there is a demand for better performance memory that can suppress the memory macro area with small bit cells, as well as non-volatile memory to keep a code or an administration data without external memories. Embedded STT-MRAM has a bit cell size that is less than one-third of that of SRAM and possesses non-volatile characteristics, and eMRAM is suitable for small-scale systems such as smart MCUs that do not have external memory. Therefore, at this point, eMRAM has been commercialized in GNSS (GPS), smart watch and wireless communication systems. In the same way, it is presumed to be suitable for frame buffer memory and data memory in image sensor systems. This talk will present how the device can enhance its functionality with the assumption of application in image sensors.
The full program is available here: https://sites.google.com/view/mramforum/program-booklet