Monday, July 14, 2014

TSV and Image Sensors

Yole Developpement's 2014 update of "3DIC & 2.5D TSV Interconnect for Advanced Packaging" report shows that image sensors keep being the biggest application for TSV technologies in the nearest years:

Posted by Vladimir Koifman at 21:34

2 comments:

  1. AnonymousJuly 16, 2014 at 3:55 PM

    If Sony's curved sensor works 3D IC is dead...

    ReplyDelete
    Replies
    1. AnonymousJuly 16, 2014 at 7:09 PM

      No it's not. Stacked sensors are no less bendable than normal BSI sensors. With a stacked sensor you are replacing the blank carrier wafer with an active wafer. The final thickness of the stack can be very thin.

      3D sensors only means two layers of silicon for the foreseeable future.

      Delete

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