Teledyne DALSA Introduces WLP to its LWIR Imaging Platform

Teledyne DALSA demonstrates its Wafer-Level-Packaged (WLP) 320 x 240 Vanadium Oxide microbolometer. Why is it such a big deal? The vacuum packaging cost is a major contributor to the micorbolometer imager price and its reduction is a breakthrough for the whole industry.

The company says: "Our novel wafer-level packaging (WLP) approach to microbolometer manufacturing in an optimized MEMS infrastructure gives us the ability to dramatically alter the traditional price-performance tradeoff.

Our advanced capabilities in wafer processing allows us to bond multiple 200 mm wafers precisely in a 3D stack that eliminates the need for external chip packaging--packaging which can account for 75% or more of device cost.

By stacking a cap wafer, using world-leading vacuum sealing technology, onto a CMOS high-speed readout circuit (ROIC) wafer populated with VOx pixels, we deliver smaller, lighter devices with leading edge performance and game-changing lower costs, enabling compact detectors with advanced integrated features that will drive the next phase in the evolution of uncooled IR imaging."