Friday, May 30, 2025

Photonic color-splitting image sensor startup Eyeo raises €15mn

Eyeo raises €15 million seed round to give cameras perfect eyesight

  • Eyeo replaces traditional filters with advanced color-splitting technology originating from imec, world-leading research and innovation hub in nanoelectronics and digital technologies. For the first time, photons are not filtered but guided to single pixels, delivering maximum light sensitivity and unprecedented native color fidelity, even in challenging lighting conditions.
  • Compatible with any sensor, eyeo’s single photon guiding technology breaks resolution limits - enabling truly effective sub-0.5-micron pixels for ultra-compact, high-resolution imaging in XR, industrial, security, and mobile applications - where image quality is the top purchasing driver.

Eindhoven (Netherlands), May 7, 2025 – eyeo today announced it has raised €15 million in seed funding, co-led by imec.xpand, Invest-NL, joined by QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM). Eyeo revolutionizes the imaging market for consumer, industrial, XR and security applications by drastically increasing the light sensitivity of image sensors. This breakthrough unlocks picture quality, color accuracy, resolution, and cost efficiency, which was never before possible in smartphones and beyond.

The €15 million raised will drive evaluation kit development, prepare for scale manufacturing of a first sensor product, and expand commercial partnerships to bring this breakthrough imaging technology to market.

The Problem: Decades-old color filter technology throws away 70% of light, crippling sensor performance
For decades, image sensors have relied on the application of red, green, and blue color filters on pixels to make your everyday color picture or video. Color filters, however, block a large portion of the incoming light, and thereby limit the sensitivity of the camera. Furthermore, they limit the scaling of the pixel size below ~0.5 micron. These longstanding issues have stalled advancements in camera technology, constraining both image quality and sensor efficiency. In smartphone cameras, manufacturers have compensated for this limitation by increasing the sensor -and thus camera- size, to capture more light. While this improves low-light performance, it also leads to larger, bulkier cameras. Compact, high-sensitivity image sensors are essential for slimmer smartphones and emerging applications such as robotics and AR/VR devices, where size, power efficiency, and image quality are crucial.

The Breakthrough: Color-splitting via vertical waveguides
Eyeo introduces a novel image sensor architecture that eliminates the need for traditional color filters, making it possible to maximize sensitivity without increasing sensor size. Leveraging breakthrough vertical waveguide-based technology that splits light into colors, eyeo develops sensors that efficiently capture and utilize all incoming light, tripling sensitivity compared to existing technologies. This is particularly valuable in low-light environments, where current sensors struggle to gather enough light for clear, reliable imaging. Additionally, unlike traditional filters that block certain colors (information that is then interpolated through software processing), eyeo’s waveguide technology allows pixels to receive complete color data. This approach instantly doubles resolution, delivering sharper, more detailed images for applications that demand precision, such as computational photography, machine vision, and spatial computing. 

Jeroen Hoet, CEO of eyeo: “Eyeo is fundamentally redefining image sensing by eliminating decades-old limitations. Capturing all incoming light and drastically improving resolution is just the start—this technology paves the way for entirely new applications in imaging, from ultra-compact sensors to enhanced low-light performance, ultra-high resolution, and maximum image quality. We’re not just improving existing systems; we’re creating a new standard for the future of imaging.”

Market Readiness and Roadmap
Eyeo has already established partnerships with leading image sensor manufacturers and foundries to ensure the successful commercialization of its technology. The €15M seed funding will be used to improve its current camera sensor designs further, optimizing the waveguide technology for production scalability and accelerating the development of prototypes for evaluation. By working closely with industry leaders, eyeo aims to bring its advanced camera sensors to a wide range of applications, from smartphones and VR glasses to any compact device that uses color cameras. The first evaluation kits are expected to be available for selected customers within the next two years. 

Eyeo is headquartered in Eindhoven (NL), with an R&D office in Leuven (BE).

Friday, May 23, 2025

Glass Imaging raises $20mn

PR Newswire: https://www.prnewswire.com/news-releases/glass-imaging-raises-20-million-funding-round-to-expand-ai-imaging-technologies-302451849.html

Glass Imaging Raises $20 Million Funding Round To Expand AI Imaging Technologies

LOS ALTOS, Calif., May 12, 2025 /PRNewswire/ -- Glass Imaging, a company harnessing the power of artificial intelligence to revolutionize digital image quality, today unveiled a Series A funding round led by global software investor Insight Partners. The $20 million round will allow Glass Imaging to continue to refine and implement their proprietary GlassAI technologies across a wide range of camera platforms - from smartphones to drones to wearables and more. The Series A round was joined by previous Glass Imaging investors GV (Google Ventures), Future Ventures and Abstract Ventures.

Glass Imaging uses artificial intelligence to extract the full image quality potential on current and future cameras by reversing lens aberrations and sensor imperfections. Glass works with manufacturers to integrate GlassAI software to boost camera performance 10x resulting in sharper, more detailed images under various conditions that remain true to life with no hallucinations or optical distortions.

"At Glass Imaging we are building the future of imaging technology," said Ziv Attar, Founder and CEO, Glass Imaging. "GlassAI can unlock the full potential of all cameras to deliver stunning ultra-detailed results and razor sharp imagery. The range of use cases and opportunities across industry verticals are huge."

"GlassAI leverages edge AI to transform Raw burst image data from any camera into stunning, high-fidelity visuals," said Tom Bishop, Ph.D., Founder and CTO, Glass Imaging. "Our advanced image restoration networks go beyond what is possible on other solutions: swiftly correcting optical aberrations and sensor imperfections while efficiently reducing noise, delivering fine texture and real image content recovery that outperforms traditional ISP pipelines."

"We're incredibly proud to lead Glass Imaging's Series A round and look forward to what the team will build next as they seek to redefine just how great digital image quality can be," said Praveen Akkiraju, Managing Director, Insight Partners. "The ceiling for GlassAI integration across any number of platforms and use cases is massive. We're excited to see this technology expand what we thought cameras and imaging devices were capable of." Akkiraju will join Glass Imaging's board and Insight's Jonah Waldman will join Glass Imaging as a board observer.

Glass Imaging previously announced a $9.3M extended Seed funding round in 2024 led by GV and joined by Future Ventures, Abstract and LDV Capital. That funding round followed an initial Seed investment in 2021 led by LDV Capital along with GroundUP Ventures.

For more information on Glass Imaging and GlassAI visit https://www.glass-imaging.com/

Wednesday, May 21, 2025

Sony-Leopard Imaging collaboration LI-IMX454

From PR Newswire: https://www.prnewswire.com/news-releases/leopard-imaging-and-sony-semiconductor-solutions-collaborate-to-showcase-li-imx454-multispectral-cameras-at-automate-and-embedded-vision-summit-302452836.html

Leopard Imaging and Sony Semiconductor Solutions Collaborate to Showcase LI-IMX454 Multispectral Cameras at Automate and Embedded Vision Summit

FREMONT, Calif., May 12, 2025 /PRNewswire/ -- Leopard Imaging Inc., a global innovator in intelligent vision solutions, is collaborating with Sony Semiconductor Solutions Corporation (Sony) to present the cutting-edge LI-IMX454 Multispectral Camera at both Automate and Embedded Vision Summit.

Leopard Imaging launched LI-USB30-IMX454-MIPI-092H camera with high-resolution imaging across diverse lighting spectrums, powered by Sony's advanced IMX454 multispectral image sensor. Unlike conventional RGB sensors, Sony's IMX454 image sensor integrates eight distinct spectral filters directly onto each photodiode, allowing the camera to capture light across 41 wavelengths from 450 nm to 850 nm in a single shot utilizing Sony's dedicated signal processing—without the need for mechanical scanning or bulky spectral elements.

Multispectral imaging has historically been underutilized due to cost and complexity. With the LI-IMX454, Leopard Imaging and Sony aim to democratize access to this powerful technology by offering a compact, ready-to-integrate solution for a wide range of industries: from industrial inspection to medical diagnostics, precision agriculture, and many more.

"We're excited to collaborate with Sony to bring this next-generation imaging solution to market," said Bill Pu, President and Co-Founder of Leopard Imaging. "The LI-IMX454 cameras not only deliver high-resolution multispectral data but also integrate seamlessly with AI and machine vision systems for intelligent decision-making."

The collaboration also incorporates Sony's proprietary signal processing software, optimized to support key functions essential to multispectral imaging: defect correction, noise reduction, auto exposure control, robust non-RGB based classification, and color image generation.

Leopard Imaging and Sony will showcase live demos of LI-IMX454 cameras at both Automate and Embedded Vision Summit. To visit Automate: Huntington Place, Booth #8000 on May 12-13. To visit Embedded Vision Summit: Santa Clara Convention Center, Booth #700 on May 21 - 22. To arrange a meeting at the event, please contact marketing@leopardimaging.com.

Conference List - November 2025

IEEE Nuclear Science Symposium, Medical Imaging Conference, and Room-Temperature Semiconductor Detectors Symposium - 1-8 November 2025 - Yokohama, Japan - Website

SPIE Future Sensing Technologies 2025 - 11-13 November 2025 - Yokohama, Japan - Website

14th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD 14) - 16-21 November 2025 - Taipei, Taiwan - Website

Compamed - 17-20 November 2025 - Dusseldorf, Germany - Website

SEMI MEMS & Imaging Sensors Summit 2025 - 19-20 November 2025 - Munich, Germany - Website

17th Symposium Sensor Data Fusion: Trends, Solutions and Applications - Bonn, Germany - 24-26 November 2025 - Website

RSNA 2025 - 30 November-4 December 2025 - Chicago, Illinois, USA - Website


If you know about additional local conferences, please add them as comments.

Return to Conference List index

Friday, May 09, 2025

Counterpoint Research's CIS report

Global Smartphone CIS Shipments Climb 2% YoY in 2024

Samsung is no longer in the top-3 smartphone CIS suppliers.


  •  Global smartphone image sensor shipments rose 2% YoY to 4.4 billion units in 2024.
  • Meanwhile, the average number of cameras per smartphone declined further to 3.7 units in 2024 from 3.8 units in 2023.
  • Sony maintained its leading position, followed by GalaxyCore in second place and OmniVision in third.
  • Global smartphone image sensor shipments are expected to fall slightly YoY in 2025.

 

https://www.counterpointresearch.com/insight/post-insight-research-notes-blogs-global-smartphone-cis-shipments-climbs-2-yoy-in-2024/

Wednesday, May 07, 2025

IS&T EI 2025 plenary talk on imaging and AI


 

This plenary presentation was delivered at the Electronic Imaging Symposium held in Burlingame, CA over 2-6 February 2025. For more information see: http://www.electronicimaging.org

Title: Imaging in the Age of Artificial Intelligence

Abstract: AI is revolutionizing imaging, transforming how we capture, enhance, and experience visual content. Advancements in machine learning are enabling mobile phones to have far better cameras, enabling capabilities like enhanced zoom, state-of-the-art noise reduction, blur mitigation, and post-capture capabilities such as intelligent curation and editing of your photo collections, directly on device.
This talk will delve into some of these breakthroughs, and describe a few of the latest research directions that are pushing the boundaries of image restoration and generation, pointing to a future where AI empowers us to better capture, create, and interact with visual content in unprecedented ways.

Speaker: Peyman Milanfar, Distinguished Scientist, Google (United States)

Biography: Peyman Milanfar is a Distinguished Scientist at Google, where he leads the Computational Imaging team. Prior to this, he was a Professor of Electrical Engineering at UC Santa Cruz for 15 years, two of those as Associate Dean for Research. From 2012-2014 he was on leave at Google-x, where he helped develop the imaging pipeline for Google Glass. Over the last decade, Peyman's team at Google has developed several core imaging technologies that are used in many products. Among these are the zoom pipeline for the Pixel phones, which includes the multi-frame super-resolution ("Super Res Zoom") pipeline, and several generations of state of the art digital upscaling algorithms. Most recently, his team led the development of the "Photo Unblur" feature launched in Google Photos for Pixel devices.
Peyman received his undergraduate education in electrical engineering and mathematics from the UC Berkeley and his MS and PhD in electrical engineering from MIT. He holds more than two dozen patents and founded MotionDSP, which was acquired by Cubic Inc. Along with his students and colleagues, he has won multiple best paper awards for introducing kernel regression in imaging, the RAISR upscaling algorithm, NIMA: neural image quality assessment, and Regularization by Denoising (RED). He's been a Distinguished Lecturer of the IEEE Signal Processing Society and is a Fellow of IEEE "for contributions to inverse problems and super-resolution in imaging".

Monday, May 05, 2025

Brillnics mono-IR global shutter sensor

Miyauchi et al. from Brillnics Inc., Japan published a paper titled "A 3.96-μm, 124-dB Dynamic-Range, Digital-Pixel Sensor With Triple- and Single-Quantization Operations for Monochrome and Near-Infrared Dual-Channel Global Shutter Operation" in IEEE JSSC (May 2025).

Abstract: This article presents a 3.96- μ m, 640×640 pixel stacked digital pixel sensor capable of capturing co-located monochrome (MONO) and near-infrared (NIR) frames simultaneously in a dual-channel global shutter (GS) operation. A super-pixel structure is proposed with diagonally arranged 2×2 MONO and NIR sub-pixels. To enhance visible light sensitivity, large and small non-uniform micro-lenses are formed on the MONO and NIR sub-pixels, respectively. Each floating diffusion (FD) shared super-pixel is connected to an in-pixel analog-to-digital converter and two banks of 10-bit static random access memories (SRAMs) to enable the dual-channel GS operation. To achieve high dynamic range (DR) in the MONO channel, a triple-quantization (3Q) operation is performed. Furthermore, a single-channel digital-correlated double sampling (D-CDS) 3Q operation is implemented. The fabricated sensor achieved 6.2-mW low power consumption at 30 frames/s with dual-channel capture. The MONO channel achieved 124-dB DR in the 3Q operation and 60 dB for the NIR channel. The sensor fits the stringent form-factor requirement of an augmented reality headset by consolidating MONO and NIR imaging capabilities.

Open access link: https://ieeexplore.ieee.org/document/10706075 

Concept of HDR dual-channel GS operation.
 
 

Pixel level co-located MONO and NIR sub-pixels.

 

Sub-pixel and SRAM-bank usage. (a) Dual-channel operation. (b) Single-channel digital-CDS operation.

Fabricated chip. (a) Chip micrograph. (b) Chip top-level block diagram.

 

Photo-response and SNR curves of digital-CDS operation (after linearization).

 

Sample images captured by dual-channel operation. (a) MONO frame (HDR image). (b) NIR frame ( 2× gain for visual).

Thursday, May 01, 2025

Sony SSSpeculations

Several news sources are repeating a Bloomberg report that Sony is considering partially spinning off its semiconductor business.

https://finance.yahoo.com/news/sony-reportedly-mulling-semiconductor-unit-155046940.html 

Sony Group is contemplating a spinoff of its semiconductor unit, a move that could see Sony Semiconductor Solutions become an independent entity as early as this year, reports Bloomberg. The move, which is still under discussion, is part of the group’s strategy to streamline business operations and concentrate on core entertainment sector. The potential spinoff would involve distributing most of Sony's holding in the chip business to its shareholders while retaining a minority stake.

https://www.trendforce.com/news/2025/04/29/news-sony-reportedly-mulls-chip-division-spinoff-and-listing-to-strengthen-entertainment-focus/ 

According to Bloomberg, sources indicate that Sony Group is weighing the spin-off of its semiconductor subsidiary, Sony Semiconductor Solutions, with an IPO potentially taking place as early as this year. Another report from Bloomberg adds that the move would mark the PlayStation maker’s latest step in streamlining its operations and strengthening its focus on entertainment. As noted by the report, sources indicate that Sony is exploring a “partial spin-off” structure, under which the parent company would retain a stake in the subsidiary.