Sunday, December 05, 2010
Hands-On Image Sensor Evaluation Course
Albert Theuwissen published his experience of teaching the first "Hands-On Evaluation of Image Sensors" course. The 2-day course took place two weeks ago in Barcelona under CEI-Europe umbrella. Next time the improved version of this unique course will be delivered in May 2011 in Copenhagen.
Saturday, December 04, 2010
Panasonic 3D D-Imager is now Off-the-Shelf Product Available from Distributors
PR Web: Panasonic 3D ToF D-IMager is now available for purchase through Arrow and Digi-Key.
The proprietary CCD-based D-IMager's has an average current consumption of 0.4A out of 24V DC supply, allowing it to be lightweight and fan-less. Other spec parameters are quoted below:
The proprietary CCD-based D-IMager's has an average current consumption of 0.4A out of 24V DC supply, allowing it to be lightweight and fan-less. Other spec parameters are quoted below:
Friday, December 03, 2010
Hynix Targets Notebooks with its 1MP 720p Video Sensor
Hynix announced 1/6-inch 1MP 720p/30fps HD video sensor aimed to notebook market. The YACC611CBDFH (Hi-162) sensor outputs raw RGB and needs an external ISP. The sensor is based on 2.0um pixels and packaged in ShellUT CSP package.
Thursday, December 02, 2010
CMOSIS Announces 600fps VGA Sensor
CMOSIS previewed 1/3" VGA (648 x 488) format sensor. The new CMV300 will use the same 8T pixel structure as the high-resolution series CMV2000/CMV4000 / CMV12000. With 7.4 µm square pixels, a noise level of 9 e- and a full well charge of 20,000 electrons, the new CMV300 realizes a dynamic range of more than 66 dB, which can be extended through several HDR operational modes.
The CMV300 pixel architecture features its low parasitic light sensitivity and CDS in global shutter mode. The sensor's 12-bit ADC delivers 600 full VGA frames per second over four LVDS outputs of 600 Mbit/sec each.
CMV300 comes in a monochrome version fitted with micro lenses, and in a color version featuring RGB Bayer patterns as well as micro lenses. Prototypes will be out by mid-2011.
The CMV300 pixel architecture features its low parasitic light sensitivity and CDS in global shutter mode. The sensor's 12-bit ADC delivers 600 full VGA frames per second over four LVDS outputs of 600 Mbit/sec each.
CMV300 comes in a monochrome version fitted with micro lenses, and in a color version featuring RGB Bayer patterns as well as micro lenses. Prototypes will be out by mid-2011.
Sony CineAlta Moves Beyond Bayer
Hugo Gaggion, Sony Broadcast & Professional Solutions CTO, presented 2K/4K roadmap at NYC 2010 HD World show in mid-October. Sony published a video of this presentation discussing color filter pattern innovations, among many other things.
The previous generation of Sony CineAlta CCD-based Super 35mm cameras used linear RGB pattern:
To maintain the high resolution in green in all directions, including diagonal one, Sony proposes a new Q67 pattern for new 4K camera systems:
Bayer Pattern can produce a lot of artifacts:
Sony Q67 pattern produces less color artifacts:
Eventually Sony plans to switch over to full-color 4K sensors:
The competitive landscape on Super 35mm camera market, as Sony sees it:
Thanks to A.A. for sending me the link!
The previous generation of Sony CineAlta CCD-based Super 35mm cameras used linear RGB pattern:
To maintain the high resolution in green in all directions, including diagonal one, Sony proposes a new Q67 pattern for new 4K camera systems:
Bayer Pattern can produce a lot of artifacts:
Sony Q67 pattern produces less color artifacts:
Eventually Sony plans to switch over to full-color 4K sensors:
The competitive landscape on Super 35mm camera market, as Sony sees it:
Thanks to A.A. for sending me the link!
Wednesday, December 01, 2010
Andor Launches Cooled sCMOS Camera
Andor announced the launch of the Neo camera platform based on scientific CMOS (sCMOS) technology. The company calls Neo sCMOS the most significant camera launch in the recent times. The sensor spec has been improved by TE cooling down to -40C. Specifically, the read noise went down to 1e- at 30fps full resolution speed and 1.4e- at 100fps speed (was 2e in not cooled sensor).
Thanks to R.C. for sending me the info!
Thanks to R.C. for sending me the info!
EVG Improves Wafer Level Lens Molding Process
PR Newswire: EV Group (EVG) announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to 8MP and higher) wafer-level optics for use in smart phones, pico projectors and other applications. The new Monolithic Lens Molding (MLM) capability, which was developed in-house by EVG's process development team, is available as an option on the company's IQ Aligner UV nanoimprint lithography (UV-NIL) system or can be upgraded to existing equipment. EVG expects to ship its first IQ Aligner with the MLM option in the first half of 2011.
In wafer-level camera production today, glass substrates are typically used as carrier and spacer wafers for the lenses, which are composed of an optical polymer material. The different material characteristics of these components limit resolution and picture quality. EVG's MLM process overcomes this limitation by eliminating the need for glass substrates. Instead, the polymer is molded between two stamps and then cured with UV exposure by the EVG's IQ Aligner system. By omitting the glass substrates, wafer-level optics manufacturers face fewer constraints on the optic and lens stack design—enabling the production of thinner lens wafers and significantly shorter optical stacks.
In addition, since the IQ Aligner molds the micro-lenses using a room-temperature UV-NIL process versus thermal imprinting, a high degree of precision alignment is achieved between the various elements in the optical lens stack—maximizing device performance.
In wafer-level camera production today, glass substrates are typically used as carrier and spacer wafers for the lenses, which are composed of an optical polymer material. The different material characteristics of these components limit resolution and picture quality. EVG's MLM process overcomes this limitation by eliminating the need for glass substrates. Instead, the polymer is molded between two stamps and then cured with UV exposure by the EVG's IQ Aligner system. By omitting the glass substrates, wafer-level optics manufacturers face fewer constraints on the optic and lens stack design—enabling the production of thinner lens wafers and significantly shorter optical stacks.
In addition, since the IQ Aligner molds the micro-lenses using a room-temperature UV-NIL process versus thermal imprinting, a high degree of precision alignment is achieved between the various elements in the optical lens stack—maximizing device performance.
Omnivision Pleased with OmniBSI-2 Progress
Seeking Alpha published Omnivision quarterly earnings call transcript. Some interesting quotes:
Shaw Hong, CEO:
...we shipped record volumes of image sensors exceeding 180 million units. This is the highest level of units ever shipped by OmniVision in the first quarter.
...Now pursuing design wins for BSI-2 and we believe we are more than a generation ahead of most competitors. We anticipate shipping BSI-2 based products in the next calendar year.
...our CameraCube products are gaining traction and we are shipping those products in steady volumes.
Ray Cisneros, VP WW Sales:
In our second fiscal quarter we shipped a record high of nearly of 185 million units as compared to 134 million units in our prior quarter. The average selling price in our fiscal second quarter was $1.29 as compared to $1.44 in the prior quarter.
The sequential drop in the average selling price was driven by the shift in our products mix mainly due to a surge in shipments of our new BSI HD sensor OV9726 and our new specialized VGA product of the OV3738. These chips are ... smaller in size and therefore carry a lower ASP.
...OmniBSI has been adopted ... by all Tier 1 customers in all segments.
...we're going to refrain from breaking out too much detail in regards to our specific plans around BSI-2. ... we are extremely, extremely pleased with the engineering progress that has transpired with this platform. We are extremely pleased with the product developments that are directly taking place today and we're very, very pleased with our engagements with Tier 1 leading customers to adopt Omni BSI-2. All that being said we're lining up for some time within the next calendar year to start ramping up production and ramping up initial projects with customers. I would say sometime in the early, the latter half of the Q2, Q3 timeframe calendar year next year would be the ramp of some of these activities.
Shaw Hong, CEO:
...we shipped record volumes of image sensors exceeding 180 million units. This is the highest level of units ever shipped by OmniVision in the first quarter.
...Now pursuing design wins for BSI-2 and we believe we are more than a generation ahead of most competitors. We anticipate shipping BSI-2 based products in the next calendar year.
...our CameraCube products are gaining traction and we are shipping those products in steady volumes.
Ray Cisneros, VP WW Sales:
In our second fiscal quarter we shipped a record high of nearly of 185 million units as compared to 134 million units in our prior quarter. The average selling price in our fiscal second quarter was $1.29 as compared to $1.44 in the prior quarter.
The sequential drop in the average selling price was driven by the shift in our products mix mainly due to a surge in shipments of our new BSI HD sensor OV9726 and our new specialized VGA product of the OV3738. These chips are ... smaller in size and therefore carry a lower ASP.
...OmniBSI has been adopted ... by all Tier 1 customers in all segments.
...we're going to refrain from breaking out too much detail in regards to our specific plans around BSI-2. ... we are extremely, extremely pleased with the engineering progress that has transpired with this platform. We are extremely pleased with the product developments that are directly taking place today and we're very, very pleased with our engagements with Tier 1 leading customers to adopt Omni BSI-2. All that being said we're lining up for some time within the next calendar year to start ramping up production and ramping up initial projects with customers. I would say sometime in the early, the latter half of the Q2, Q3 timeframe calendar year next year would be the ramp of some of these activities.
Anteryon Shows Profits but its IPO Delayed
BNR quotes Reuters saying that Anterion initially aimed at an IPO in the third quarter of this year. Early next year it must be clear how soon that step can be realized. Partly to the poor stock market climate, the company has decided to attract a strategic investor - Qualcomm.
Meanwhile, this year for the first time since its separation from Philips in 2006 Anteryon has shown profits on a turnover of around 20M euros. The company expects that sales will grow next year. Anteryon supplies its wafer level lenses to all major mobile phone brands including Nokia, Samsung and Motorola.
Meanwhile, this year for the first time since its separation from Philips in 2006 Anteryon has shown profits on a turnover of around 20M euros. The company expects that sales will grow next year. Anteryon supplies its wafer level lenses to all major mobile phone brands including Nokia, Samsung and Motorola.
CAT PUMA Pursues Image Sensor Applications
Chip Estimate: Cambridge Analog Technologies (CAT) has developed Precision Ultra Micro-power Amplification (PUMA) technology-based ADC IP applicable to image sensor applications. The company implements MIT-developed low-power switched capacitor techniques. While most switched cap circuits rely on op-amps, CAT uses zero-cross detectors (ZCD) to switch on/off capacitor charging sources:
The ZCD-based circuits are said to consume one to two orders of magnitude less power than op-amp for the same settling time and accuracy. Now power numbers are given in the article, while white papers published on the company's site suggest much smaller savings.
The ZCD-based circuits are said to consume one to two orders of magnitude less power than op-amp for the same settling time and accuracy. Now power numbers are given in the article, while white papers published on the company's site suggest much smaller savings.
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