Friday, February 11, 2011

Himax Announces 2010 Results, Blames Capacity Limitations

Himax reported its 2010 results, including image sensor ones. Himax CEO Jordan Wu said:

"2010 was the year when we commenced mass production for several new product
areas, including CMOS image sensors, wafer-level optics, wafer-level camera modules...

CMOS image sensor is and will continue to be a fastgrowing area for us. We currently offer VGA, 1.3 mega pixel, HD, 2 mega pixel and 3 mega pixel products focusing on handset and notebook camera modules. While we are a new comer to the market, our sensors have been highly praised by several customers with leading market positions to have outperformed those offered by the incumbent players in terms of image quality. Consequently we have won numerous design-wins from customers ranging from camera module makers, contract manufacturers to system integrators with world leading brand names.

While our current shipments are handicapped by the serious wafer foundry capacity shortage from which the industry is suffering, we remain confident that we will deliver phenomenal volume growth and strong market expansion this year. To what extent our sensor products will grow this year will depend largely on the availability of foundry capacity.
"

Chipworks: Sony-Ericsson SE006 16MP Sensor is Based on 1.12um Pixel

Chipworks reverse engineered the new Sony-Ericsson SE006 phone and revealed that its 16MP BSI sensor is based on 1.12um pixels. Chipworks writes:

"Sony is again first to market – this time with a next generation 1.1 µm class pixel. Sony announced the IMX081PQ Exmor-R CMOS image sensor and IU081F camera module in October 2010. Featuring 1.12 µm pixels, the camera modules are claimed to be the smallest and thinnest modules of this resolution for mobile phones. These devices mark Sony’s first deployment of Exmor-R (back illuminated) sensors in mobile applications, and are part of Sony’s strategy to aggressively pursue design wins in high-end mobile phones.

The 10.5 mm x 10.5 mm x 7.9 mm module features a chip-on-board (COB) mounted image sensor, an autofocus mechanism, and a printed wiring board (PWB) with embedded components – something which Sony has been a bit of a laggard on until now. The IMX081PQ uses Bayer patterned color filters and microlenses on a 1.1 µm pitch.
"


Thursday, February 10, 2011

Samsung Introduces 8MP 1.4um Pixel BSI Sensor

Korea IT Times, Korea Newswire: Samsung unveils its new 1/3.2-inch 8MP CMOS imager, S5K3H2, based on 1.4um BSI pixels. The new imager supports up to 15fps at full resolution and 1080p HD video up to 30fps. It also offers video recording of 720p at 60fps and VGA resolution images at 120fps for slow motion playback function all on a mobile phone.

The S5K3H2 is said to be able to operate on 1.2 voltage levels - I would cross-check if this is the only supply, once the official Samsung info becomes available. The sensor fits in 8.5mm x 8.5mm auto focus camera module with a height dimension of 6.0mm.

The S5K3H2 is sampling now and is scheduled for mass production in Q2 this year.

Sony-Ericsson Announces 16MP BSI Sensor

Impress: This one seems to be announced in Japan only, but Sony Ericsson presented KDDI-aimed S006 phone featuring what's said to be the world's highest resolution BSI sensor today - 16MP Sony-made imager. Not much is known about this sensor, but the phone supports 12fps burst mode at full resolution.



Unfortunately, Japan-based image sensor blog seems to stop updating recently, otherwise we could learn more about the new Sony sensor from it.

Samsung Announces 1.12um BSI Pixels with RGB-W Option, Companion ISP

Korea IT Times, Korea Newswire: Samsung announced 1.12um BSI pixel-based 12MP imager. The new 1/3.2-inch S5K3L1 speed is 30fps at full resolution, 60fps in 1080p HD video mode, 90fps at 720p or 120fps at VGA resolution for slow motion playback function in mobile phones. The new sensor also includes an on-chip pixel correction feature, compensating color and luminance response variations "to address image distortion".

In addition, the 12MP imager offers an optional RGB-white color filter array claimed to deliver 30% brighter image over that of a conventional RGB color filter array. The RGB-white filter feature works in conjunction with a complimentary logic chip (S5C73L1), which converts RGB-White pattern to RGB Bayer for back-end Bayer ISP compatibility. The logic chip also provides features such as lens shading correction, image down scaling, noise reduction and significantly enhanced modulation transfer function to reproduce fine details.

Samsung's S5K3L1 imager is designed to fit into 8.5mm x 8.5mm auto focus camera module with a z-dimension of 6.0mm for slim mobile phones and small form factor applications.

Samples of the S5K3L1 imager are available now with mass production scheduled in Q3 of this year. The S5K3L1 will be displayed at the Mobile World Congress, Barcelona, Spain.

Wednesday, February 09, 2011

Pelican Imaging Comes Out of Stealth Mode

Pelican Imaging announced that it has developed the first prototype array camera for mobile devices. Pelican Imaging has developed a computational camera array architecture and IP with 12 pending patent applications in array optics, sensors and image reconstruction algorithms. Pelican’s camera improves upon image and video quality while allowing for thinner smartphones. New applications are also enabled by introducing features such as 3-D depth, gesture control, and the ability for users to interact with the image before and after capturing the shot.

The company also announced its Technical Advisory Board members: Dr. Marc Levoy, Dr. Shree K. Nayar and Dr. Bedabrata Pain.

What Pelican has developed represents a paradigm shift in imaging and video that has the potential to overcome many of the inherent limitations of mobile cameras,” said Dr. Shree Nayar, professor at Columbia University.

Dr. Marc Levoy, professor at Stanford University commented, “Pelican’s technology has the potential to upset the traditional tradeoff between the sensitivity and resolution of a camera and its thickness. It also brings new capabilities to cameras, including post-capture focusing, foveal imaging and programmable frame rates. We have been investigating these aspects of computational photography in our laboratory at Stanford for a number of years, through the Stanford Multi-Camera Array, which is big, slow and expensive. Pelican’s solution is small, fast and inexpensive – which makes it a very exciting technology.

Pelican's architecture relaxes key pixel design constraints, thereby enhancing pixel performance beyond those in legacy cameras. I am equally excited about its potential for early and cost-effective adoption of new sensor technologies. The next generation of mini- and micro-cameras is upon us,” said Dr. Bedabrata Pain, CEO of Edict Inc.

From the company site it looks like Pelican's idea is to use many small lenses instead of a big one (something similar to Newport Imaging?):


Also, there is a nice article about Pelican's approach at Gigaom.

Thanks to OG for sending me the info!

Imatest and Graphin Offer Image Sensor Evaluation Suite

PR Newswire: Now Imatest's IS Edition interfaces directly with Graphin's "GPirates" (an evaluation suite for image sensor products), enabling engineers to quickly configure image sensors, using GPirates, and then immediately assess image quality with the IS Edition software. By combining Graphin's GPirates capabilities with Imatest's IS Edition, images can now be directly read from the sensor and analyzed, instantly providing product engineers with the information they need to optimize sensor settings, including: sharpness, noise, blemish detection, dynamic range, color accuracy, distortion, uniformity, lateral chromatic aberration, and ISO sensitivity.

Tuesday, February 08, 2011

40M Camera Phones Use DxO EDoF Technology

SL from DxO Labs kindly sent me another press release that seems to appear nowhere on the web. I'd guess most of the 40M phones the PR talks about are shipped by Nokia. Since the PR can not be found elsewhere, here is the full text:

February 8th, 2011, Paris – As Mobile World Congress 2011 is about to open in Barcelona, DxO Labs announces that to date, more than 40 million camera modules featuring its unique Extended Depth of Field (EDoF) technology have been shipped. DxO Labs' EDoF technology, also known as DxO DOP (Digital Optics Processing), has been licensed to several leading sensor vendors and has been successfully implemented on 3-, 5-, and 8-megapixel sensor chips for a large range of best-selling mobile phones.

DxO Labs' EDoF unique technology allows fixed-focus lenses to become a viable alternative to traditional autofocus: it delivers sharp images from as close as 10 cm (depending on sensor size and resolution) out to infinity, with instant focus and zero shutter lag, and allows drastic shrinking of camera module size and cost. Further, it enables value-added imaging features such as barcode decoding and OCR.

"40 million cameraphones shipped with DxO DOP represents a very important milestone," says Jerome Meniere, CEO of DxO Labs. "It means that DxO Labs' EDoF technology is now widely adopted in the market. We expect to reach the 100 million units threshold in 2011."

DxO DOP7+, the latest generation of DxO Labs' EDoF technology, dramatically improves image quality and pushes the frontiers of EDoF performance still further to meet increasingly challenging smartphone requirements in term of cost, image quality, and size. DxO DOP7+ will be showcased at Mobile World Congress 2011.

About DxO DOP7+

DxO DOP technology is based on the co-design of optics and image signal processing. DxO DOP uses standard, fixed-focus lenses which are "powered" by an image-processing silicon IP block to achieve new imaging properties.

DOP7+, the latest generation of DxO Labs' patented EDoF technology, dramatically improves image quality and performance compared to previous generations. DOP7+ delivers unique end-user benefits:
  1. Extended Depth of Field (EDoF): DxO DOP7+ uses standard fixed-focus lenses to deliver sharp images from as close as 10 cm (depending on sensor size and resolution) out to infinity. This allows close-up reading of 1D and 2D bar codes, and easy document or business card scanning.
  2. Instant focus and zero shutter lag: compared to traditional autofocus, DOP7+ has zero shutter lag, and delivers images that are always sharp, with no latency nor focusing errors, leading to a much better user experience.
  3. Much lower cost and size than traditional autofocus: DxO DOP7+ removes the need for costly, bulky, and fragile actuator-based autofocus systems, leading to a much lower bill of material and very thin, compact cameraphones.
Update: The PR was published in Embedded Imaging section of DxO web site. Thanks to SL for letting me know!

PTC in Deep Saturation

Albert Theuwissen published a new post in PTC series, this time talking large signal effects, saturation, etc.

Canon's BSI or Not BSI

DPReview, CNET and some other sites claim that the newly announced Canon ELPH 500 HS (IXUS 310 HS in Europe) camera has BSI sensor. The 1/2.3-inch sensor's resolution and speed is 12.1MP/3.4fps and it is capable of 1080p24 video.

However, the official Canon PRs do not mention the backside illumination at all. They only talk about "HS System" that excels in low light: Canon US PR and Canon UK PR. It would be strange if Canon really hides BSI feature under HS title.

Thanks to JB for pointer to the Canon announcements!