Sunday, February 23, 2020
Smartphone Camera Forecast Revised Downwards
IFNews quotes CLSA report revising smartphone camera market growth expectations due to coronavirus impact:
Saturday, February 22, 2020
EETimes on Prophesee and Sony Partnership
EETimes reporter Junko Yoshida publishes an article "Sony, Prophesee Open ‘Pandora’s Box’ in AI Sensing." Few quotes:
“Given the nature of our technology that uses a lot of transistors, electronics and photodiodes, working with Sony was always our first choice,” [Prophesee CEO Luca] Verre told EE Times. The companies started to work together in 2017. Verre promised that samples of the first stacked event-based vision sensors will be available in 2020.
Prophesee CEO Verre noted that Sony’s role in the partnership is not limited to a foundry. With solid knowledge and an IP portfolio of its own in event-based technology, Verre said, “We came to the table with a clear idea as to how we wanted to design pixels.” The two companies’ collaborative efforts made possible the new event-driven sensor design — from analog, logic and power — combined with Sony’s advanced manufacturing process.
The relationship isn’t a pure R&D exercise either, noted Verre. The intention is to maintain a long-term partnership that will bring the technology to the commercial market while developing applications."
“Given the nature of our technology that uses a lot of transistors, electronics and photodiodes, working with Sony was always our first choice,” [Prophesee CEO Luca] Verre told EE Times. The companies started to work together in 2017. Verre promised that samples of the first stacked event-based vision sensors will be available in 2020.
Prophesee CEO Verre noted that Sony’s role in the partnership is not limited to a foundry. With solid knowledge and an IP portfolio of its own in event-based technology, Verre said, “We came to the table with a clear idea as to how we wanted to design pixels.” The two companies’ collaborative efforts made possible the new event-driven sensor design — from analog, logic and power — combined with Sony’s advanced manufacturing process.
The relationship isn’t a pure R&D exercise either, noted Verre. The intention is to maintain a long-term partnership that will bring the technology to the commercial market while developing applications."
Friday, February 21, 2020
Single-Pixel MEMS Imaging
MDPI paper "Single-Pixel MEMS Imaging Systems" by Guangcan Zhou, Zi Heng Lim, Yi Qi, and Guangya Zhou from National University of Singapore reviews the scanning approaches:
"Single-pixel imaging technology is an attractive technology considering the increasing demand of imagers that can operate in wavelengths where traditional cameras have limited efficiency. Meanwhile, the miniaturization of imaging systems is also desired to build affordable and portable devices for field applications. Therefore, single-pixel imaging systems based on microelectromechanical systems (MEMS) is an effective solution to develop truly miniaturized imagers, owing to their ability to integrate multiple functionalities within a small device. MEMS-based single-pixel imaging systems have mainly been explored in two research directions, namely the encoding-based approach and the scanning-based approach. The scanning method utilizes a variety of MEMS scanners to scan the target scenery and has potential applications in the biological imaging field. The encoding-based system typically employs MEMS modulators and a single-pixel detector to encode the light intensities of the scenery, and the images are constructed by harvesting the power of computational technology. This has the capability to capture non-visible images and 3D images. Thus, this review discusses the two approaches in detail, and their applications are also reviewed to evaluate the efficiency and advantages in various fields."
"Single-pixel imaging technology is an attractive technology considering the increasing demand of imagers that can operate in wavelengths where traditional cameras have limited efficiency. Meanwhile, the miniaturization of imaging systems is also desired to build affordable and portable devices for field applications. Therefore, single-pixel imaging systems based on microelectromechanical systems (MEMS) is an effective solution to develop truly miniaturized imagers, owing to their ability to integrate multiple functionalities within a small device. MEMS-based single-pixel imaging systems have mainly been explored in two research directions, namely the encoding-based approach and the scanning-based approach. The scanning method utilizes a variety of MEMS scanners to scan the target scenery and has potential applications in the biological imaging field. The encoding-based system typically employs MEMS modulators and a single-pixel detector to encode the light intensities of the scenery, and the images are constructed by harvesting the power of computational technology. This has the capability to capture non-visible images and 3D images. Thus, this review discusses the two approaches in detail, and their applications are also reviewed to evaluate the efficiency and advantages in various fields."
Albert Theuwissen Reviews ISSCC 2020 - Part 2
The second part of the review starts with Samsung small-pixel paper "A 1/2.65inch 44Mpixel CMOS image sensor with 0.7 um pixels fabricated in advanced full-depth deep-trench isolation technology" by HyunChul Kim, Jongeun Park, Insung Joe, Doowon Kwon, Joo Hyoung Kim, Dongsuk Cho, Taehun Lee, Changkyu Lee, Haeyong Park, Soojin Hong, Chongkwang Chang, Jingyun Kim, Hanjin Lim, Youngsun Oh, Yitae Kim, Seungjoo Nah, Sangill Jung, Jaekyu Lee, JungChak Ahn, Hyeongsun Hong, Kyupil Lee, and Ho-Kyu Kang. The paper explains Bosch HART process used to create thin vertical DTI with large aspect ratio:
Artilux paper "An up-to-1400 nm 500MHz Demodulated time-of-flight image sensor on a Ge-on-Si platform" by C.-L. Chen, S.-W. Chu, B.-J. Chen, Y.-F. Lyu, K.-C. Hsu, C.-F. Liang, S.-S. Su, M.-J. Yang, C.-Y. Chen, S.-L. Cheng, H.-D. Liu, C.-T. Lin, K. P. Petrov, H.-W. Chen, K.-C. Chu, P.-C. Wu, P.-T. Huang, N. Na, and S.-L. Chen reports 50% QE at 1550nm for a Ge-on-Si stacked BSI sensor:
Artilux paper "An up-to-1400 nm 500MHz Demodulated time-of-flight image sensor on a Ge-on-Si platform" by C.-L. Chen, S.-W. Chu, B.-J. Chen, Y.-F. Lyu, K.-C. Hsu, C.-F. Liang, S.-S. Su, M.-J. Yang, C.-Y. Chen, S.-L. Cheng, H.-D. Liu, C.-T. Lin, K. P. Petrov, H.-W. Chen, K.-C. Chu, P.-C. Wu, P.-T. Huang, N. Na, and S.-L. Chen reports 50% QE at 1550nm for a Ge-on-Si stacked BSI sensor:
Thursday, February 20, 2020
Albert Theuwissen Reviews ISSCC 2020 - Part 1
Albert Theuwissen's review of ISSCC 2020 starts from Sony paper "A 132 dB single exposure dynamic range CMOS image sensor with high temperature tolerance" by Y. Sakano, T. Toyoshima, R. Nakamura, T. Asatsuma, Y. Hattori, T. Yamanaka, R. Yoshikawa, N. Kawazu, T. Matsuura, Iinuma, T. Toya, T. Watanabe, A. Suzuki, Y. Motohashi, J. Azami, Y. Tateshita, T. Haruta, and F. Brady.
Samsung paper “A 2.1 e temporal noise and -105 dB parasitic light sensitivity backside-illuminated 2.3 um pixel voltage domain global shutter CMOS image sensor using high-capacity DRAM capacitor technology” by Jae-kyu Lee, Seung Sik Kim, In-Gyu Baek, Heesung Shim, Taehoon Kim, Taehyoung Kim, Jungchan Kyoung, Dongmo Im, Jinyong Choi, KeunYeong Cho, Daehoon Kim, Haemin Lim, Min-Woong Seo, JuYoung Kim, Doowon Kwon, Jiyoun Song, Jiyoon Kim, Minho Jang, Joosung Moon, HyunChul Kim, Chong Kwang Chang, JinGyun Kim, Kyoungmin Koh, HanJin Lim, JungChak Ahn, Hyeongsun Hong, Kyupil Lee, Ho-Kyu Kang presents one of the industry smallest GS pixels.
Samsung paper “A 2.1 e temporal noise and -105 dB parasitic light sensitivity backside-illuminated 2.3 um pixel voltage domain global shutter CMOS image sensor using high-capacity DRAM capacitor technology” by Jae-kyu Lee, Seung Sik Kim, In-Gyu Baek, Heesung Shim, Taehoon Kim, Taehyoung Kim, Jungchan Kyoung, Dongmo Im, Jinyong Choi, KeunYeong Cho, Daehoon Kim, Haemin Lim, Min-Woong Seo, JuYoung Kim, Doowon Kwon, Jiyoun Song, Jiyoon Kim, Minho Jang, Joosung Moon, HyunChul Kim, Chong Kwang Chang, JinGyun Kim, Kyoungmin Koh, HanJin Lim, JungChak Ahn, Hyeongsun Hong, Kyupil Lee, Ho-Kyu Kang presents one of the industry smallest GS pixels.
trinamiX Presents "Live Skin" Facial Recognition
PRNewswire: trinamiX GmbH has joined the Qualcomm Software Accelerator Program to enable its patented technology for "live skin" detection for facial recognition on mobile devices. OEM customers will now be able to use the trinamiX proprietary "Beam Profile Analysis" technology, which extracts 3 data streams from a single camera system: a 2D IR image, a 3D depth map and most uniquely – material classification.
The material classification is accomplished through trinamiX proprietary algorithms that run on the Qualcomm Hexagon Processor on Snapdragon platforms. This ability to classify and identify materials based on their physical properties is a result of trinamiX research and development while operating as a wholly owned subsidiary of BASF.
"Using our patented 3D imaging technology, the solution will enable mobile devices powered by the Hexagon Processor inside Snapdragon mobile platforms to achieve a previously unattainable goal – the ability to sense live skin as part of a secure facial recognition," said Ingmar Bruder, Managing Director and founder of trinamiX.
Fastcompany publishes on the new trinamiX technology: "The Trinamix system combines a near-infrared spectroscopy 1-megapixel sensor with LED flood illumination and a light projector—both designed to be eye-safe—with proprietary beam analysis, to gauge the composition of the material the sensor is pointed at. Wood reflects back a different beam pattern than plastic, even if both have the identical shape and color. And because even slightly different materials reflect differently, the technology can tell the difference between skin with blood flowing under it and skin without."
The company's video demos the material recognition:
The material classification is accomplished through trinamiX proprietary algorithms that run on the Qualcomm Hexagon Processor on Snapdragon platforms. This ability to classify and identify materials based on their physical properties is a result of trinamiX research and development while operating as a wholly owned subsidiary of BASF.
"Using our patented 3D imaging technology, the solution will enable mobile devices powered by the Hexagon Processor inside Snapdragon mobile platforms to achieve a previously unattainable goal – the ability to sense live skin as part of a secure facial recognition," said Ingmar Bruder, Managing Director and founder of trinamiX.
Fastcompany publishes on the new trinamiX technology: "The Trinamix system combines a near-infrared spectroscopy 1-megapixel sensor with LED flood illumination and a light projector—both designed to be eye-safe—with proprietary beam analysis, to gauge the composition of the material the sensor is pointed at. Wood reflects back a different beam pattern than plastic, even if both have the identical shape and color. And because even slightly different materials reflect differently, the technology can tell the difference between skin with blood flowing under it and skin without."
The company's video demos the material recognition:
Wednesday, February 19, 2020
Panasonic Develops 1MP APD-based ToF Sensor with 250m Range
Panasonic has developed a TOF image sensor that uses APD pixels and is capable of acquiring highly accurate 3D information at distances up to 250 m. The applications of the new sensor include automotive range imaging and wide-area surveillance.
The new sensor has 1MP resolution and depth accuracy of 10cm at the distances from 10m to 100m. This is an improvement over the previous generation Panasonic APD sensor announced in June 2018 that had an accuracy of 1.5m.
The new sensor has 1MP resolution and depth accuracy of 10cm at the distances from 10m to 100m. This is an improvement over the previous generation Panasonic APD sensor announced in June 2018 that had an accuracy of 1.5m.
OmniVision Announces Solution to Shortage of 2MP Image Sensors
PRNewswire: OmniVision announces a 2M image sensor OV02B manufactured using 12ʺ wafers, instead of the 8ʺ wafers that are in tight supply but are typically used for 2MP sensors. The OmniPixel3-HS pixel technology provides the OV02B with a 1.75um pixel pitch in a 1/5ʺ optical format.
"The strong growth trend in smartphone multicameras that we saw in 2019, for both main and front-facing cameras, is continuing to accelerate in 2020. In the entry level and mainstream markets, smartphone camera designers favor 2MP image sensors to produce bokeh effects, as they provide a significant cost advantage over higher resolution sensors," said Parson Li, OmniVision's senior mobile product marketing manager. "While the demand for 2MP image sensors is growing, there is a shortage of the 8ʺ wafers used to produce them. Our new OV02B is built on 12ʺ wafers while maintaining a die size that is comparable to our existing 2MP sensors, offering an effective alternative for cost sensitive entry level and mainstream smartphones."
"The strong growth trend in smartphone multicameras that we saw in 2019, for both main and front-facing cameras, is continuing to accelerate in 2020. In the entry level and mainstream markets, smartphone camera designers favor 2MP image sensors to produce bokeh effects, as they provide a significant cost advantage over higher resolution sensors," said Parson Li, OmniVision's senior mobile product marketing manager. "While the demand for 2MP image sensors is growing, there is a shortage of the 8ʺ wafers used to produce them. Our new OV02B is built on 12ʺ wafers while maintaining a die size that is comparable to our existing 2MP sensors, offering an effective alternative for cost sensitive entry level and mainstream smartphones."
Prophesee and Sony Develop a Stacked Event-Based Vision Sensor with the Industry’s Smallest Pixels and Highest HDR Performance
Prophesee S.A. and Sony announce they have jointly developed a stacked Event-based vision sensor with the industry’s smallest 4.86μm pixel size and the industry’s highest 124dB (or more) HDR performance. This sensor combines of Sony’s stacked CMOS sensor process with Cu-Cu connections, with Prophesee’s Metavision Event-based vision technologies leading to fast pixel response, high temporal resolution and high throughput data readout. The newly developed sensor is suitable for various machine vision applications, such as detecting fast moving objects in a wide range of environments and conditions.
The 1/2-inch format sensor has 1280x720 resolution and uses 40nm logic process. The 124dB (or more) HDR performance is made possible by placing only BSI pixels and a part of N-type MOS transistor on the pixel chip (top), thereby allowing the aperture ratio to be enhanced by up to 77%. High sensitivity/low noise technologies Sony has developed over many years of CMOS image sensor development enable event detection in low-light conditions (40mlx).
By adding time information at 1μs precision to the pixel address where a change in luminance has occurred, event data readout with high time resolution is ensured. Furthermore, a high output event rate of 1.066Geps*5 has been achieved by efficiently compressing the event data, i.e. luminance change polarity, time, and x/y coordinate information for each event.
The 1/2-inch format sensor has 1280x720 resolution and uses 40nm logic process. The 124dB (or more) HDR performance is made possible by placing only BSI pixels and a part of N-type MOS transistor on the pixel chip (top), thereby allowing the aperture ratio to be enhanced by up to 77%. High sensitivity/low noise technologies Sony has developed over many years of CMOS image sensor development enable event detection in low-light conditions (40mlx).
By adding time information at 1μs precision to the pixel address where a change in luminance has occurred, event data readout with high time resolution is ensured. Furthermore, a high output event rate of 1.066Geps*5 has been achieved by efficiently compressing the event data, i.e. luminance change polarity, time, and x/y coordinate information for each event.
TowerJazz Updates on its CIS Business
SeekingAlpha transcript of TowerJazz Q4 2019 earnings call updates on the foundry's image sensor business:
"Moving to our Sensors Business unit, despite in organic revenue decline of about 20% in the industrial sensor market, predominantly a consequence of the trade war, we were able to compensate to great extent, to have a decrease of 4% year-over-year organic revenues. The set compensation was via the growth of our X-ray medical sensors market and our high-end visible camera market. This growth should continue in 2020 and with an expected recovery and industrial sensor market, we target a double-digit organic growth in this business in 2020.
2019 was an exciting year for our future both in state-of-the-art technology developments and in customer engagements. As announced, we have released our 300 millimeter back side illumination hybrid bonding stack way for technology with copper to copper electrical contacts, and a pitch smaller than 2.5 micron, the smallest in the world. This technology allows a connection of a BSI sensor to a CMOS logic and analog wafer at the pixel level. We won two major customers that are using this technology for the mobile time of flight market both for face recognition and front looking 3D application.
These products will grow into mass volume production in 2022. The same technology will be used with our existing customers for high end photography market both in high end DSLR and mirrorless cameras and in cinematography.
In addition, we engage with large optical fingerprint sensor providers on the development of under OLED and under LCD sensors utilizing our high performing CIS technologies and our 200 -millimeter fabs at the point when eight micron technology node. These products are expected to wrap in the second half of this year and to further grow to high volumes in 2021 and beyond."
"Moving to our Sensors Business unit, despite in organic revenue decline of about 20% in the industrial sensor market, predominantly a consequence of the trade war, we were able to compensate to great extent, to have a decrease of 4% year-over-year organic revenues. The set compensation was via the growth of our X-ray medical sensors market and our high-end visible camera market. This growth should continue in 2020 and with an expected recovery and industrial sensor market, we target a double-digit organic growth in this business in 2020.
2019 was an exciting year for our future both in state-of-the-art technology developments and in customer engagements. As announced, we have released our 300 millimeter back side illumination hybrid bonding stack way for technology with copper to copper electrical contacts, and a pitch smaller than 2.5 micron, the smallest in the world. This technology allows a connection of a BSI sensor to a CMOS logic and analog wafer at the pixel level. We won two major customers that are using this technology for the mobile time of flight market both for face recognition and front looking 3D application.
These products will grow into mass volume production in 2022. The same technology will be used with our existing customers for high end photography market both in high end DSLR and mirrorless cameras and in cinematography.
In addition, we engage with large optical fingerprint sensor providers on the development of under OLED and under LCD sensors utilizing our high performing CIS technologies and our 200 -millimeter fabs at the point when eight micron technology node. These products are expected to wrap in the second half of this year and to further grow to high volumes in 2021 and beyond."
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