Saturday, April 02, 2016

iPhone SE Features Sony and Omnivision Sensors

Chipworks reverse engineering reveals that Apple iPhone SE FaceTime front-facing camera uses Omnivision 1.2MP sensor with pixel pitch of 1.75 µm. The die, which features OV2E0BNN die markings, has a size of 4.3 mm x 4.1 mm (17.6 mm2):


The rear camera contains a Sony stacked (Exmor RS) sensor with a 6.02 mm x 4.83 mm (29.1 mm2) die size. The pixel pitch is 1.22 µm, as was used for the iPhone 6s/6s Plus. The decapsulated die photos from the SE and 6s Plus rear image sensors appear to be the same chip:

Posted by Vladimir Koifman at 23:17

4 comments:

  1. AnonymousApril 3, 2016 at 1:25 AM

    I am curious to know who makes the OIS module for the camera. That one is extremely impressive.

    ReplyDelete
    Replies
    1. AnonymousApril 4, 2016 at 10:37 AM

      No OIS, only EIS on iPhone SE. Only iPhone 6S Plus has OIS.

      Delete
  2. AnonymousApril 3, 2016 at 11:48 PM

    It sounds like they've dropped the 2x2 HDR cell used in the earlier front facing camera. I'm not surprised. It was very unimpressive.

    ReplyDelete
  3. AnonymousApril 5, 2016 at 12:49 AM

    OV2E0B is such an old dude, they made it 2012. Iphone SE is exactly a dump trash can .

    ReplyDelete

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